IRF730S Vishay, IRF730S Datasheet

MOSFET N-CH 400V 5.5A D2PAK

IRF730S

Manufacturer Part Number
IRF730S
Description
MOSFET N-CH 400V 5.5A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRF730S

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1 Ohm @ 3.3A, 10V
Drain To Source Voltage (vdss)
400V
Current - Continuous Drain (id) @ 25° C
5.5A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
38nC @ 10V
Input Capacitance (ciss) @ Vds
700pF @ 25V
Power - Max
3.1W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF730S

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF730S
Manufacturer:
IR
Quantity:
3 000
Company:
Part Number:
IRF730SPBF
Quantity:
70 000
Company:
Part Number:
IRF730STR
Quantity:
16 095
Part Number:
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Manufacturer:
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Part Number:
IRF730STRLPBF
Quantity:
70 000
Part Number:
IRF730STRPBF
Manufacturer:
IR
Quantity:
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Part Number:
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Manufacturer:
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Quantity:
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Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91048
S-81276-Rev. A, 16-Jun-08
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Linear Derating Factor (PCB Mount)
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(nC)
(V)
≤ 5.5 A, dI/dt ≤ 90 A/µs, V
= 50 V, starting T
(Ω)
K
SMD-220
a
a
D
G
J
= 25 °C, L = 16 mH, R
S
c
a
DD
b
V
≤ V
GS
e
= 10 V
DS
G
, T
N-Channel MOSFET
J
e
Single
≤ 150 °C.
400
5.7
38
22
G
SMD-220
IRF730SPbF
SiHF730S-E3
IRF730S
SiHF730S
= 25 Ω, I
D
S
C
Power MOSFET
= 25 °C, unless otherwise noted
V
1.0
GS
AS
at 10 V
= 5.5 A (see fig. 12).
T
T
for 10 s
C
A
= 25 °C
= 25 °C
T
T
C
C
= 100 °C
= 25 °C
FEATURES
• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The SMD-220 is a surface mount power package capable of
accommodating die size up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in
any existing surface mount package. The SMD-220 is
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0 W
in a typical surface mount application.
SYMBOL
T
dV/dt
J
V
V
E
E
I
I
P
, T
device
I
DM
AR
DS
GS
AS
AR
D
D
stg
SMD-220
IRF730STRLPbF
SiHF730STL-E3
IRF730STRL
SiHF730STL
IRF730S, SiHF730S
design,
- 55 to + 150
a
a
LIMIT
0.025
300
± 20
0.59
400
290
5.5
3.5
5.5
7.4
3.1
4.0
22
74
low
a
a
d
Vishay Siliconix
on-resistance
www.vishay.com
UNIT
W/°C
V/ns
RoHS*
COMPLIANT
mJ
mJ
°C
W
V
A
A
Available
and
1

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IRF730S Summary of contents

Page 1

... SMD-220 IRF730SPbF SiHF730S-E3 IRF730S SiHF730S = 25 °C, unless otherwise noted ° 100 ° ° °C A for Ω 5.5 A (see fig. 12 ≤ 150 °C. J IRF730S, SiHF730S Vishay Siliconix device design, low on-resistance SMD-220 a IRF730STRLPbF a SiHF730STL-E3 a IRF730STRL a SiHF730STL SYMBOL LIMIT V 400 DS V ± 5 3 0.59 ...

Page 2

... IRF730S, SiHF730S Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Maximum Junction-to-Ambient a (PCB Mount) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Fig Typical Output Characteristics, T Fig Typical Output Characteristics, T Document Number: 91048 S-81276-Rev. A, 16-Jun- °C Fig Typical Transfer Characteristics C = 150 °C Fig Normalized On-Resistance vs. Temperature C IRF730S, SiHF730S Vishay Siliconix www.vishay.com 3 ...

Page 4

... IRF730S, SiHF730S Vishay Siliconix Fig Typical Capacitance vs. Drain-to-Source Voltage Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig Typical Source-Drain Diode Forward Voltage Fig Maximum Safe Operating Area Document Number: 91048 S-81276-Rev. A, 16-Jun-08 ...

Page 5

... Fig. 12a - Unclamped Inductive Test Circuit Document Number: 91048 S-81276-Rev. A, 16-Jun- Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit d(on) Fig. 10b - Switching Time Waveforms + Fig. 12b - Unclamped Inductive Waveforms IRF730S, SiHF730S Vishay Siliconix D.U. d(off www.vishay.com 5 ...

Page 6

... IRF730S, SiHF730S Vishay Siliconix Fig. 12c - Maximum Avalanche Energy vs. Drain Current Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com 6 Current regulator Same type as D.U.T. 50 kΩ 0.2 µF 0.3 µ D.U. Current sampling resistors Fig. 13b - Gate Charge Test Circuit Document Number: 91048 ...

Page 7

... SD • D.U.T. - device under test P.W. Period D = Period P.W. waveform SD Body diode forward current dI/dt waveform DS Diode recovery dV/dt Body diode forward drop Ripple ≤ for logic level devices Fig For N-Channel IRF730S, SiHF730S Vishay Siliconix + + www.vishay.com 7 ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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