IRF7410 International Rectifier Corp., IRF7410 Datasheet

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IRF7410

Manufacturer Part Number
IRF7410
Description
Manufacturer
International Rectifier Corp.
Datasheet

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Thermal Resistance
These P-Channel HEXFET
International Rectifier utilize advanced processing
techniques to achieve the extremely low on-resistance
per silicon area. This benefit provides the designer
with an extremely efficient device for use in battery
and load management applications..
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infrared, or wave soldering technique
Description
www.irf.com
R
V
I
I
I
P
P
V
T
D
D
DM
DS
D
D
GS
J,
θJA
@ T
@ T
Ultra Low On-Resistance
P-Channel MOSFET
Surface Mount
Available in Tape & Reel
T
@T
@T
STG
A
A
A
A
= 70°C
= 25°C
= 25°C
= 70°C
Maximum Junction-to-Ambient
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
®
Power MOSFETs from
Parameter
Parameter
ƒ
ƒ
GS
GS
ƒ
@ -4.5V
@ -4.5V
G
S
S
S
V
-12V
DSS
1
2
3
4
Top View
HEXFET Power MOSFET
13mΩ@V
7mΩ@V
9mΩ@V
8
6
5
7
-55 to +150
R
Max.
Max.
DS(on)
50
D
D
D
D
-12
-16
-13
-65
2.5
1.6
A
20
±8
GS
GS
GS
IRF7410
max
= -4.5V
= -2.5V
= -1.8V
SO-8
-
-
13.6A
11.5A
-
16A
mW/°C
Units
Units
I
°C/W
D
°C
V
A
V
1
8/2/06

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IRF7410 Summary of contents

Page 1

... Junction and Storage Temperature Range J, STG Thermal Resistance Parameter R Maximum Junction-to-Ambient θJA www.irf.com V DSS -12V Top View @ -4. -4.5V GS ƒ ƒ ƒ IRF7410 HEXFET Power MOSFET R max I DS(on) D 7mΩ@V = -4.5V 16A - GS 9mΩ@V = -2.5V 13. 13mΩ@V = -1.8V 11. ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient ∆V /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage ...

Page 3

PULSE WIDTH Tj = 25°C 0.1 0 Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100 ° 150 ° ...

Page 4

0V MHZ C iss = SHORTED 12000 C rss = oss = 10000 Ciss 8000 6000 4000 ...

Page 5

T , Case Temperature Fig 9. Maximum Drain Current Vs. Case Temperature 100 D = 0.50 0.20 10 0.10 0.05 0.02 1 0.01 SINGLE PULSE 0.1 (THERMAL RESPONSE) 0.01 ...

Page 6

-16A 0.004 0.002 0.0 2.0 4.0 -V GS, Gate -to -Source Voltage (V) Fig 12. Typical On-Resistance Vs. Gate Voltage Charge Fig 14a. Basic Gate Charge ...

Page 7

Temperature ( °C ) Fig 15. Typical Vgs(th) Vs. Junction Temperature www.irf.com 700 600 500 400 -250µA 300 200 100 0 0.0001 0.0010 ...

Page 8

SO-8 Package Details 0.25 [.010 NOT DIMENS IONING & T OLERANCING PER AS ME ...

Page 9

Tape and Reel TERMINAL NUMBER 1 8.1 ( .318 ) 7.9 ( .312 ) NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. NOTES : 1. CONTROLLING DIMENSION : ...

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