IRL3103S International Rectifier, IRL3103S Datasheet

MOSFET N-CH 30V 64A D2PAK

IRL3103S

Manufacturer Part Number
IRL3103S
Description
MOSFET N-CH 30V 64A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRL3103S

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
12 mOhm @ 34A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
64A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
33nC @ 4.5V
Input Capacitance (ciss) @ Vds
1650pF @ 25V
Power - Max
94W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRL3103S

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Part Number
Manufacturer
Quantity
Price
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l
l
l
l
l
l
Thermal Resistance
Description
Absolute Maximum Ratings
Advanced HEXFET
Rectifier utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET power MOSFETs
are well known for, provides the designer with an
extremely efficient and reliable device for use in a wide
variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
The through-hole version (IRL3103L) is available for low-
profile applications.
www.irf.com
R
R
I
I
I
P
V
I
E
dv/dt
T
T
D
D
DM
AR
2
J
STG
D
GS
AR
Pak is suitable for high current applications because of its
JC
JA
@ T
@ T
Advanced Process Technology
Surface Mount (IRL3103S)
Low-profile through-hole (IRL3103L)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
2
C
C
C
Pak is a surface mount power package capable of
= 25°C
= 100°C
= 25°C
®
Peak Diode Recovery dv/dt
Junction-to-Case
Junction-to-Ambient (PCB mount)**
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Power MOSFETs from International
Parameter
Parameter


ƒ
GS
GS

@ 10V
@ 10V
G
Typ.
300 (1.6mm from case )
–––
–––
10 lbf•in (1.1N•m)
HEXFET
-55 to + 175
IRL3103S
D
S
D
Max.
0.63
220
± 16
5.0
2
64
45
94
34
22
Pak
®
R
Power MOSFET
Max.
DS(on)
IRL3103S
V
IRL3103L
1.6
40
DSS
I
D
IRL3103L
= 64A
TO-262
PD - 94162
= 12m
= 30V
Units
Units
°C/W
W/°C
V/ns
mJ
°C
W
A
V
A
02/14/02
1

Related parts for IRL3103S

IRL3103S Summary of contents

Page 1

... Advanced Process Technology l Surface Mount (IRL3103S Low-profile through-hole (IRL3103L) 175°C Operating Temperature l l Fast Switching Fully Avalanche Rated l Description ® Advanced HEXFET Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ...

Page 2

... IRL3103S/IRL3103L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 1000  ° 100 20µs PULSE WIDTH 1 2.0 3.0 4.0 5 Gate-to-Source Voltage (V) GS Fig 3. Typical Transfer Characteristics www.irf.com IRL3103S/IRL3103L  1000 TOP BOTTOM 100 10 ° 1 0.1 10 100 Fig 2. Typical Output Characteristics 2 2.0  ° 175 C J 1.5 1.0 ...

Page 4

... IRL3103S/IRL3103L  3000 1MHz iss rss gd 2500 oss 2000 C iss  1500 C oss 1000 500  C rss Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 100  ° 175 ° 0.1 0.0 0.4 0.8 1.2 V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode Forward Voltage ...

Page 5

... Case Temperature 0.50 0.20 0.10 0.05  0.1 SINGLE PULSE 0.02 (THERMAL RESPONSE) 0.01 0.01 0.00001 0.0001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com IRL3103S/IRL3103L Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b. Switching Time Waveforms ...

Page 6

... IRL3103S/IRL3103L Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 6 240 1 5V 200 160 + - 120 Starting T , Junction Temperature ( C) Fig 12c. Maximum Avalanche Energy Fig 13b. Gate Charge Test Circuit  I D TOP 14A ...

Page 7

... Reverse Polarity of D.U.T for P-Channel Driver Gate Drive D.U.T. I Reverse Recovery Current D.U.T. V Re-Applied Voltage Inductor Curent *** V Fig 14. For N-channel www.irf.com IRL3103S/IRL3103L Peak Diode Recovery dv/dt Test Circuit + Circuit Layout Considerations * Low Stray Inductance Ground Plane ƒ Low Leakage Inductance Current Transformer - - dv/dt controlled controlled by Duty Factor " ...

Page 8

... IRL3103S/IRL3103L 2 D Pak Package Outline 1 0.54 (.415 ) 1 0.29 (.405 ) 1.4 0 (.055 ) - AX. 2 1 5.49 (.6 10) 1 4.73 (.5 80 1.40 (.0 55) 3X 1.14 (.0 45) 0 0 .08 (.20 0) 0.25 (. FTER & 4. TRO L LIN ATSINK & SIO Pak Part Marking Information TIO (. (.16 5) 1 ...

Page 9

... TO-262 Package Outline TO-262 Part Marking Information www.irf.com IRL3103S/IRL3103L 9 ...

Page 10

... IRL3103S/IRL3103L 2 D Pak Tape & Reel Information TIO . -418 . LIN SIO LIM DIM DIST WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 (. (. (. (. 1 1 .42 (. .22 (. .75 (. 0 .25 (. 0 13.50 (.532 ) 2 7.4 0 (1.079 ) 12.80 (.504 ) 2 3.9 0 (.9 41 ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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