IRLZ34NS International Rectifier, IRLZ34NS Datasheet

MOSFET N-CH 55V 30A D2PAK

IRLZ34NS

Manufacturer Part Number
IRLZ34NS
Description
MOSFET N-CH 55V 30A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRLZ34NS

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
35 mOhm @ 16A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
30A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
25nC @ 5V
Input Capacitance (ciss) @ Vds
880pF @ 25V
Power - Max
3.8W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRLZ34NS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRLZ34NS
Manufacturer:
IR
Quantity:
180
Part Number:
IRLZ34NS
Manufacturer:
INTERNATIONAL RECTIFIER
Quantity:
30 000
Part Number:
IRLZ34NS
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRLZ34NSPBF
Manufacturer:
IR
Quantity:
21 490
Part Number:
IRLZ34NSTRL
Manufacturer:
TI
Quantity:
3 756
Part Number:
IRLZ34NSTRLPBF
Manufacturer:
NICHICON
Quantity:
46 000
Company:
Part Number:
IRLZ34NSTRLPBF
Quantity:
9 000
Company:
Part Number:
IRLZ34NSTRLPBF
Quantity:
30 000
Part Number:
IRLZ34NSTRRPBF
Manufacturer:
IR
Quantity:
20 000
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRLZ34NL) is available for low-
profile applications.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
P
V
E
I
E
dv/dt
T
T
R
R
AR
D
D
DM
2
AS
AR
J
STG
D
D
GS
Pak is suitable for high current applications because of
@ T
@ T
JC
JA
@T
@T
Logic-Level Gate Drive
Advanced Process Technology
Surface Mount (IRLZ34NS)
Low-profile through-hole (IRLZ34NL)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
2
Pak is a surface mount power package capable of
C
C
A
C
= 25°C
= 25°C
= 100°C
= 25°C
on-resistance per silicon area.
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Parameter
Parameter
GS
GS
@ 10V
@ 10V
This
G
Typ.
300 (1.6mm from case )
–––
–––
D P ak
HEXFET
2
-55 to + 175
IRLZ34NS/L
D
S
Max.
0.45
110
110
3.8
±16
6.8
5.0
30
21
68
16
®
R
T O -26 2
Power MOSFET
DS(on)
Max.
V
2.2
40
DSS
I
D
= 30A
PD - 91308A
= 0.035
= 55V
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
5/12/98

Related parts for IRLZ34NS

IRLZ34NS Summary of contents

Page 1

... Logic-Level Gate Drive Advanced Process Technology Surface Mount (IRLZ34NS) Low-profile through-hole (IRLZ34NL) 175°C Operating Temperature Fast Switching Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. benefit, combined with the fast switching speed and ...

Page 2

... IRLZ34NS/L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Fig 3. Typical Transfer Characteristics TOP BOTTOM 2. 0 0.1 V Fig 2. Typical Output Characteristics 3 2.5 2.0 1.5 1.0 0.5 0.0 A -60 -40 - unc tion T em perature (°C ) Fig 4. Normalized On-Resistance IRLZ34NS/L VGS 15V 12V 10V 8.0V 6.0V 4.0V 3.0V 2 0µ ° rain-to-S ource V oltage ( Vs. Temperature ...

Page 4

... IRLZ34NS iss oss rss rain-to-S ourc e V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage ° 5° 0.4 0.6 0.8 1.0 1.2 1 ourc e-to-D rain V oltage ( Fig 7. Typical Source-Drain Diode Forward Voltage Fig 6. Typical Gate Charge Vs ITE ° 5° ing lse A 1 1.6 1 ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case R Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 t , Rectangular Pulse Duration (sec) 1 IRLZ34NS D.U. 5.0V µ d(off ...

Page 6

... IRLZ34NS D.U. 5 0.01 Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform (BR)DSS tarting unc tion T em perature (° Fig 12c. Maximum Avalanche Energy 12V V GS Fig 13b. Gate Charge Test Circuit ...

Page 7

... Current Current D.U.T. V Waveform DS Diode Recovery Re-Applied Voltage Body Diode Inductor Curent Ripple for Logic Level Devices GS Fig 14. For N-Channel HEXFETS IRLZ34NS/L Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + + controlled by Duty Factor "D" P. Period V =10V ...

Page 8

... IRLZ34NS Pak Package Outline 1 0.54 (.4 15) 1 0.29 (.4 05) 1.4 0 (.055 ) - AX. 2 1 (.6 10) 1 (.5 80 1.40 (.0 55) 3X 1.14 (.0 45) 0 .93 (. .69 (. .08 (. .25 (. FTER IP & 4.5M , 198 TRO L LIN SIO ATSINK & Part Marking Information 2 D Pak TIO 4.69 (.1 85) 4.20 (.1 65) 1 ...

Page 9

... Package Outline TO-262 Outline Part Marking Information TO-262 IRLZ34NS/L ...

Page 10

... IRLZ34NS/L Tape & Reel Information 2 D Pak IRE CTIO (. (. IRE C TIO N 33 0.00 (1 4 LLIN ILL WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel 6172 96590 IR FAR EAST: K& ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

Related keywords