LM6321N National Semiconductor, LM6321N Datasheet
LM6321N
Specifications of LM6321N
LM6321
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LM6321N Summary of contents
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... Simplified Schematic Numbers are for 8-pin N DIP. VIP ™ trademark of National Semiconductor Corporation. © 2004 National Semiconductor Corporation Features n High slew rate: n Wide bandwidth: 50 MHz n Slew rate and bandwidth 100% tested n Peak output current: n High input impedance: 5 MΩ ...
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... See Application section on heat-sinking requirements. − These pins are at V potential. www.national.com Plastic DIP 00922302 Order Number LM6221N, LM6321N or LM6121J/883 See NS Package Number J08A or N08E Metal Can 00922303 Top View Order Number LM6221H or LM6121H/883 See NS Package ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Input to Output Voltage (Note 2) Input Voltage Output Short-Circuit to GND (Note 3) Storage Temperature Range Lead Temperature (Soldering, 10 seconds) Power Dissipation ...
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AC Electrical Characteristics The following specifications apply for Supply Voltage = Boldface limits apply for Symbol Parameter SR Slew Rate Slew Rate (Note 7) ...
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Typical Performance Characteristics T = 25˚C, unless otherwise specified J Frequency Response Slew Rate vs Temperature Large Signal Response kΩ L Frequency Response 00922311 Overshoot vs Capacitive Load 00922313 Large Signal Response 00922315 5 00922312 00922314 R ...
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Typical Performance Characteristics Supply Current Slew Rate Power Bandwidth www.national.com T = 25˚C, unless otherwise specified (Continued) J 00922317 00922319 Input Return Gain (S11) 00922321 6 −3 dB Bandwidth 00922318 Slew Rate 00922320 00922322 ...
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Typical Performance Characteristics Forward Transmission Gain (S12) Application Hints POWER SUPPLY DECOUPLING The method of supply bypassing is not critical for stability of the LM6121 series buffers. However, their high current out- put combined with high slew rate can result ...
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... The heat is conducted from the die, through the lead frame (inside the part), and out the pins which are soldered to the PC board. The pins used for heat conduction are: Part 00922308 LM6321N LM6321M Figure 3 shows copper patterns which may be used to dissipate heat from the LM6321. 8-Pin DIP ...
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Physical Dimensions inches (millimeters) unless otherwise noted Metal Can Package (H) Order Number LM6221H or LM6121H/883 NS Package Number H08C 8-Pin Ceramic Dual-In-Line Package (J) Order Number LM6121J/883 NS Package Number J08A 9 www.national.com ...
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... Physical Dimensions www.national.com inches (millimeters) unless otherwise noted (Continued) 14-Pin Small Outline Package (M) Order Number LM6321M NS Package Number M14A Molded Dual-In-Line Package (N) Order Number LM6221N or LM6321N NS Package Number N08E 10 ...
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... BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. ...