MC100EL11DT ON Semiconductor, MC100EL11DT Datasheet

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MC100EL11DT

Manufacturer Part Number
MC100EL11DT
Description
Clock Buffer 5V 1:2 ECL Diff
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC100EL11DT

Number Of Outputs
4
Max Input Freq
1500 MHz
Propagation Delay (max)
0.34 ns
Supply Voltage (max)
+/- 5.7 V
Supply Voltage (min)
+/- 4.2 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
TSSOP-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC100EL11DTG
Manufacturer:
ON/安森美
Quantity:
20 000
MC10EL11, MC100EL11
5.0 V ECL 1:2 Differential
Fanout Buffer
is functionally similar to the E111 device but with higher performance
capabilities. The within-device skew and propagation delay is
significantly improved over the E111.
maintain stability under open input conditions. If the inputs are left open
(pulled to V
Features
© Semiconductor Components Industries, LLC, 2008
August, 2008− Rev. 10
Figure 1. Logic Diagram and Pinout Assignment
The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device
The differential inputs of the EL11 employ clamping circuitry to
The 100 Series contains temperature compensation.
NECL Mode Operating Range: V
265 ps Propagation Delay
5 ps Skew Between Outputs
PECL Mode Operating Range: V
Internal Input Pulldown Resistors
Pb−Free Packages are Available
Table 1. PIN DESCRIPTION
Q
Q
Q
Q
PIN
D, D
Q0, Q0; Q1, Q1
V
V
EP
0
0
1
1
CC
EE
1
2
3
4
EE
) the Q outputs will go LOW.
FUNCTION
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
(DFN8 only) Thermal exposed pad must be
connected to a sufficient thermal conduit.
Electrically connect to the most negative
supply (GND) or leave unconnected,
floating open.
CC
CC
= 0 V with V
= 4.2 V to 5.7 with V
8
7
6
5
V
D
D
V
CC
EE
EE
= −4.2 V to −5.7 V
EE
1
= 0 V
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
CASE 506AA
H = MC10
K = MC100
4Q = MC10
2E = MC100
A = Assembly Location
CASE 948R
MN SUFFIX
DT SUFFIX
CASE 751
D SUFFIX
TSSOP−8
8
*For additional marking information, refer to
SOIC−8
8
Application Note AND8002/D.
DFN8
(Note: Microdot may be in either location)
1
1
ORDERING INFORMATION
http://onsemi.com
8
1
8
1
HEL11
ALYW
ALYWG
HL11
Publication Order Number:
1
G
G
DIAGRAMS*
L = Wafer Lot
Y = Year
W = Work Week
M = Date Code
G = Pb−Free Package
MARKING
4
8
1
8
1
MC10EL11/D
ALYWG
KEL11
ALYW
KL11
1
G
G
4

Related parts for MC100EL11DT

MC100EL11DT Summary of contents

Page 1

MC10EL11, MC100EL11 5.0 V ECL 1:2 Differential Fanout Buffer The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device is functionally similar to the E111 device but with higher performance capabilities. The within-device skew and propagation delay is significantly improved over ...

Page 2

Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see ...

Page 3

Table 4. 10EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

Page 4

Table 6. 100EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 10 Output LOW Voltage (Note 10 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

Page 5

Table 8. AC CHARACTERISTICS V CC Symbol Characteristic f Maximum Toggle Frequency max t Propagation Delay to Output PLH t PHL t Within-Device Skew (Note 16) SKEW Duty Cycle Skew (Note 17) t Random Clock Jitter (RMS) JITTER V Input ...

Page 6

... MC10EL11MNR4 MC10EL11MNR4G MC100EL11D MC100EL11DG MC100EL11DR2 MC100EL11DR2G MC100EL11DT MC100EL11DTG MC100EL11DTR2 MC100EL11DTR2G MC100EL11MNR4 MC100EL11MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D AN1503/D ...

Page 7

... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 8

K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...

Page 9

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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