MC100EP56DT ON Semiconductor, MC100EP56DT Datasheet

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MC100EP56DT

Manufacturer Part Number
MC100EP56DT
Description
IC MUX DUAL 2:1 5V DIFF 20TSSOP
Manufacturer
ON Semiconductor
Series
100EPr
Type
Differential Digital Multiplexerr
Datasheet
1.MC100EP56DTR2.pdf (11 pages)

Specifications of MC100EP56DT

Circuit
2 x 2:1
Independent Circuits
1
Voltage Supply Source
Dual Supply
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Output High, Low
-
Other names
MC100EP56DTOS

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MC10EP56, MC100EP56
3.3V / 5V ECL Dual
Differential 2:1 Multiplexer
Description
differential data path makes the device ideal for multiplexing low
skew clock or other skew sensitive signals. Multiple V
provided.
this device only. For single−ended input conditions, the unused
differential input is connected to V
V
and V
to 0.5 mA. When not used, V
address both data path and random logic applications.
Features
•
•
•
•
•
•
•
•
•
•
© Semiconductor Components Industries, LLC, 2008
November, 2008 − Rev. 15
BB
The MC10/100EP56 is a dual, fully differential 2:1 multiplexer. The
The V
The device features both individual and common select inputs to
The 100 Series contains temperature compensation.
with V
with V
360 ps Typical Propagation Delays
Maximum Frequency > 3 GHz Typical
PECL Mode Operating Range: V
NECL Mode Operating Range: V
Open Input Default State
Safety Clamp on Inputs
Separate and Common Select
Q Output Will Default LOW with Inputs Open or at V
V
Pb−Free Packages are Available
BB
may also rebias AC coupled inputs. When used, decouple V
CC
Outputs
BB
via a 0.01 mF capacitor and limit current sourcing or sinking
EE
EE
pin, an internally generated voltage supply, is available to
= −3.0 V to −5.5 V
= 0 V
BB
should be left open.
BB
CC
CC
as a switching reference voltage.
= 3.0 V to 5.5 V
= 0 V
EE
BB
1
pins are
BB
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
*For additional marking information, refer to
DW SUFFIX
CASE 751D
CASE 948R
MN SUFFIX
CASE 485E
(Note: Microdot may be in either location)
DT SUFFIX
TSSOP−20
Application Note AND8002/D.
SOIC−20
QFN−20
ORDERING INFORMATION
xxxx
D
A
L, WL
Y, YY
W, WW = Work Week
G, G
http://onsemi.com
= MC10 or 100
= Date Code
= Assembly Location
= Wafer Lot
= Year
= Pb−Free Package
20
1
MARKING DIAGRAMS*
Publication Order Number:
1
AWLYYWWG
MC100EP56
20
ALYWG
XXXX
EP56
ALYWG
XXXX
EP56
G
G
MC10EP56/D

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MC100EP56DT Summary of contents

Page 1

MC10EP56, MC100EP56 3.3V / 5V ECL Dual Differential 2:1 Multiplexer Description The MC10/100EP56 is a dual, fully differential 2:1 multiplexer. The differential data path makes the device ideal for multiplexing low skew clock or other skew sensitive signals. Multiple V provided. ...

Page 2

SEL0 SEL1 D0a D0a V D0b D0b D1a BBO Warning: All V and V pins must be externally connected ...

Page 3

Table 3. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see ...

Page 4

Table 5. 10EP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...

Page 5

Table 7. 10EP DC CHARACTERISTICS, NECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...

Page 6

DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 15 Output LOW Voltage (Note 15 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended Output Voltage ...

Page 7

Table 9. AC CHARACTERISTICS V Symbol Characteristic f Maximum Frequency max (See Figure 2 F /JITTER) max t , Propagation Delay to PLH Output Differential t PHL SEL COM_SEL Within−Device Skew (Note 21) ...

Page 8

... MC10EP56MNG MC10EP56MNTXG MC100EP56DW MC100EP56DWG MC100EP56DWR2 MC100EP56DR2G MC100EP56DT MC100EP56DTG MC100EP56DTR2 MC100EP56DTR2G MC100EP56MNG MC100EP56MNTXG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D AN1503/D ...

Page 9

20X 0. 18X A1 T PACKAGE DIMENSIONS SO−20 WB CASE 751D−05 ISSUE G q NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS ...

Page 10

... −V− 0.100 (0.004) −T− SEATING PLANE 16X 0.36 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE Í Í Í Í ...

Page 11

... Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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