MP3V5010 Freescale Semiconductor, Inc, MP3V5010 Datasheet

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MP3V5010

Manufacturer Part Number
MP3V5010
Description
Integrated Silicon Pressure Sensor On-chip Signal Conditioned, Temperature Compensated And Calibrated
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Small Outline Package (MP3V5010 Series)
MP3V5010GC6U
MP3V5010GC6T1
MP3V5010GP
MP3V5010DP
MP3V5010GVP
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques,
thin-film metallization, and bipolar processing to provide an accurate, high
level analog output signal that is proportional to the applied pressure.
Features
• 5.0% Maximum Error Over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over –40° to +125°C
• Thermoplastic (PPS) Surface Mount Package
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
The MP3V5010 series piezoresistive transducers are state-of-the-art
Device Name
MP3V5010GC6U/C6T1
Tape & Reel
Package
Options
CASE 482A-01
Trays
Trays
Trays
Rails
Case
482A
482A
1369
1351
1368
No.
CASE 1369-01
MP3V5010GP
SMALL OUTLINE PACKAGE
None
ORDERING INFORMATION
# of Ports
Single
Dual
CASE 1351-01
MP3V5010DP
Gauge
Application Examples
Pressure Type
Differential
Hospital Beds
HVAC
Respiratory Systems
Process Control
MP3V5010GVP
CASE 1368-01
0 to 10 kPa (0 to 1.45 psi)
MP3V5010
0.1 to 3.1 V Output
Series
Absolute
Pressure
MP3V5010G
MP3V5010G
MP3V5010GP
MP3V5010DP
MP3V5010GVP
Rev 0, 4/2009
Device Marking
MP3V5010

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MP3V5010 Summary of contents

Page 1

... Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MP3V5010 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure ...

Page 2

... Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MP3V5010 2 = 3.0 Vdc 25° ...

Page 3

... Thin Film Gain Stage #2 and Temperature Ground Compensation and Reference Gain Stage #1 Shift Circuitry Pins and 8 are NO CONNECTS for Small Outline Package Device GND 3 Pressure Value Unit 75 kPa °C –40 to +125 °C –40 to +125 4 V out MP3V5010 3 ...

Page 4

... The MP3V5010 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, ...

Page 5

... Freescale Semiconductor Transfer Function *(0.09 * P+0.08) ± ERROR out 3.0 Vdc S TEMP = 0 to 85°C MAX MIN 0 Differential Pressure (kPa) Figure 4. Output versus Pressure Differential x (0. 0.08 MP3V5010 SERIES Temp Multiplier – +125 3 –40 – Temperature in °C Pressure TYPICAL 10 80 ...

Page 6

... The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct 0.060 TYP 8X 1.52 MP3V5010 6 sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the ...

Page 7

... MILLIMETERS DIM MIN MAX MIN MAX A 0.370 0.390 9.39 9.91 A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.680 0.700 17.27 17.78 E1 0.465 0.485 11.81 12.32 e 0.100 BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 M 0.270 0.290 6.86 7.37 N 0.160 0.180 4.06 4.57 P 0.009 0.011 0.23 0.28 T 0.110 0.130 2.79 3.30 θ 0˚ 7˚ 0˚ 7˚ MP3V5010 7 ...

Page 8

... Pressure MP3V5010 8 PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...

Page 9

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE Pressure MP3V5010 9 ...

Page 10

... Pressure MP3V5010 10 PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...

Page 11

... MIN MAX MIN MAX A 0.300 0.330 7.11 7.62 A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC E E1 0.465 0.485 11.81 12.32 e 0.100 BSC 2.54 BSC F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 L 0.061 0.071 1.55 1.80 M 0.270 0.290 6.86 7.36 N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 T 0.115 0.125 2.92 3.17 θ 0˚ 7˚ 0˚ 7˚ MP3V5010 11 ...

Page 12

... For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MP3V5010 Rev. 0 4/2008 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...

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