PA241 ETC1 [List of Unclassifed Manufacturers], PA241 Datasheet
PA241
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PA241 Summary of contents
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... The PA241CE is packaged in a hermetically sealed 8-pin TO-3 package. The metal case of the PA241CE is isolated in excess of full supply voltage. The PA241DF is packaged pin PSOP (JEDEC MO- 166) package. The metal heat slug of the PA241DF is isolated in excess of full supply voltage. The PA241DW is packaged in Apex’s hermetic ceramic SIP package ...
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... Rating applies with solder connection of heatslug to a minimum 1 square inch foil area of the printed circuit board. CAUTION The PA241 is constructed from MOSFET transistors. ESD handling procedures must be observed. APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 ...
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... CL CAUTION The PA241 is constructed from MOSFET transistors. ESD handling procedures must be observed. APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com SUPPLY VOLTAGE – ...
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... The solder connection of the heatslug to a minimum of 1 square inch foil area on the printed circuit board will result in thermal performance of 25°C/W junction to air rating of the PA241DF. Solder connection to an area square PA241 5 ...
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... For additional technical information please refer to the fol- lowing Application Notes: AN1: General Operating Considerations AN3: Bridge Circuit Drives AN25: Driving Capacitive Loads AN38: Loop Stability with Reactive Loads PA241U REV B AUGUST 2005 © 2005 Apex Microtechnology Corp. OPERATING CONSIDERATIONS +Vs Z1 +Vs ...