PC123P Sharp Microelectronics, PC123P Datasheet

PHOTOCOUPLER TRAN OUT 4-SMD

PC123P

Manufacturer Part Number
PC123P
Description
PHOTOCOUPLER TRAN OUT 4-SMD
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC123P

Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
400% @ 5mA
Voltage - Output
70V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-SMD
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
425-1313-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PC123PY2J00F
Manufacturer:
SHP
Quantity:
1 688
■ Description
■ Features
PC123 Series
a phototransistor.
spacing option and SMT gullwing lead-form option.
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
3. Current transfer ratio (CTR : MIN. 50% at I
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
6. Long creepage distance type (wide lead-form type
7. High isolation voltage between input and output
Notice The content of data sheet is subject to change without prior notice.
PC123 Series contains an IRED optically coupled to
It is packaged in a 4-pin DIP, available in wide-lead
Input-output isolation voltage(rms) is 5.0kV.
CTR is 50% to 400% at input current of 5mA.
ing)
V
0.4mm)
only : MIN. 8mm)
(V
CE
iso(rms)
=5V)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
: 5.0 kV)
F
=5 mA,
1
■ Agency approvals/Compliance
■ Applications
DIP 4pin Reinforced Insulation Type
Photocoupler
1. Recognized by UL1577 (Double protection isolation),
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
3. Approved by SEMCO, EN60065, EN60950, file No.
4. Approved by DEMCO, EN60065, EN60950 (as mod-
5. Approved by NEMKO, EN60065, EN60950, file No.
6. Approved by FIMKO, EN60065, EN60950, file No.
7. Recognized by CSA file No. CA95323 (as model No.
8. Approved by VDE, VDE0884 (as an option) file No.
9. Package resin : UL flammability grade (94V - 0)
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
4. Over voltage detection
file No. E64380 (as model No. PC123)
EN60950 file No. 7409, (as model No. PC123)
204582 (as model No. PC123)
el No. PC123)
P03100205 (as model No. PC123)
19383 (as model No. PC123)
PC123)
83601 or No. 134349 or No.40005304 (as model
No. PC123)
tentials and impedances
Sheet No.: D2-A02902EN
PC123 Series
© SHARP Corporation
Date Oct. 31. 2003

Related parts for PC123P

PC123P Summary of contents

Page 1

PC123 Series ■ Description PC123 Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 50% to ...

Page 2

Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC123] Rank mark Anode mark Factory identification mark Date code 1 4 PC123 3 2 ±0.3 6.5 ±0.3 7.62 Epoxy resin ±0.1 0.26 θ θ θ ...

Page 3

... ±0.3 6.5 ±0.3 7.62 Epoxy resin ±0.25 ±0.5 0.75 10.16 0.75 MAX 12.0 6. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123PY] Rank mark Anode mark 1 2 ±0.3 4.58 ±0.25 2.54 +0.4 1.0 −0 8. Wide SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123ZY] Rank mark Anode mark ...

Page 4

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 5

Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...

Page 6

... SMT Gullwing Wide SMT Gullwing Taping 2 000pcs/reel − − Approved Approved PC123FY PC123P PC123PY PC123FP PC123FY1 PC123P1 PC123PY1 PC123FP1 PC123FY2 PC123P2 PC123PY2 PC123FP2 PC123FY5 PC123P5 PC123PY5 PC123FP5 PC123FY8 PC123PS PC123PY8 PC123FP8 6 PC123 Series I [mA] C Rank mark =5mA, V =5V, T =25˚ Approved ...

Page 7

Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...

Page 8

Fig.7 Current Transfer Ratio vs. Forward Current 300 250 200 150 100 50 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature T Fig.11 ...

Page 9

Fig.13 Test Circuit for Response Time Input V CC Output Output R Input Please refer to the conditions in Fig.12. Fig.15 Collector-emitter Saturation Voltage vs. Forward Current 5.0 =0.5mA I C 1mA 4.5 ...

Page 10

Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...

Page 11

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 12

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...

Page 13

Package specification ● Sleeve package 1. Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless ...

Page 14

Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 ...

Page 15

Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.4 0.4 Reel structure and Dimensions e ...

Page 16

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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