PC367N2 Sharp Microelectronics, PC367N2 Datasheet
PC367N2
Specifications of PC367N2
Related parts for PC367N2
PC367N2 Summary of contents
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PC367N Series ■ Description PC367N contains an IRED optically coupled to a phototransistor packaged in a 4-pin mini-flat. Low input current type. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V (*) and CTR is 100% to 500% ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. Date code SHARP mark "s" Anode mark ±0 0.4 Epoxy resin Anode 1 4 Cathode 2 Emitter 3 3 Collector ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Taping Package 3 000pcs/reel 750pcs/reel PC367N PC367NT Model No. PC367N1 PC367N1T PC367N2 PC367N2T Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. I [mA] C Rank mark (I =0.5mA, V =5V, T =25˚ with or without 0.5 to 2.5 A 0.75 to 1.5 B 1.0 to 2.0 ...
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Fig.1 Test Circuit for Common Mode Rejection Voltae Fig.2 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.4 Collector Power Dissipation vs. Ambient Temperature 200 150 100 ...
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Fig.6 Peak Forward Current vs. Duty Ratio 2 000 Pulse width≤100µ 000 500 200 100 −3 − Duty ratio Fig.8 Current Transfer Ratio vs. Forward Current 700 ...
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Fig.12 Collector Dark Current vs. Ambient Temperature −5 10 =50V V CE −6 10 −7 10 −8 10 −9 10 −10 10 −11 10 −30 −20 − Ambient temperature T Fig.14 Response Time vs. ...
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Design Considerations ● Design guide While operating at I <0.5mA, CTR variation may increase. F Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
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Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...
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Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...