PR36MF12NSZ Sharp Microelectronics, PR36MF12NSZ Datasheet
PR36MF12NSZ
Specifications of PR36MF12NSZ
Related parts for PR36MF12NSZ
PR36MF12NSZ Summary of contents
Page 1
... Zero cross type is also available. (PR26MF21NSZ Series/ PR36MF2xNSZ Series) ■ Description PR26MF1xNSZ Series and PR36MF1xNSZ Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid ...
Page 2
Internal Connection Diagram ■ Outline Dimensions 1. Through-Hole [ex. PR26MF11NSZF] ±0.3 1.2 ±0.2 1.05 SHARP Model No mark "S" Rank mark CSA mark ...
Page 3
Outline Dimensions 5. Through-Hole VDE option [ex. PR36MF11YSZF] ±0.3 1.2 ±0.2 1.05 SHARP Model No mark "S" Rank mark CSA mark VDE identification mark Date ...
Page 4
Date code (2 digit) 1st digit Year of production A.D. A.D Mark Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
Page 5
Absolute Maximum Ratings Parameter Forward current Input Reverse voltage RMS ON-state current Peak one cycle surge current Output PR26MF1xNSZ Repetitive PR36MF1xNSZ peak OFF-state voltage *1 Isolation voltage Operating temperature Storage temperature *2 Soldering temperature * 60%RH, AC ...
Page 6
... Model Line-up (2) (Lead solder plating components) Lead Form Through-Hole Sleeve Shipping Package 50pcs/sleeve DIN - Approved EN60747-5-2 PR36MF11NSZ PR36MF11YSZ PR36MF11NIP PR36MF12NSZ PR36MF12YSZ Model No. PR26MF11NSZ - PR26MF12NSZ - Please contact a local SHARP sales representative to see the actual status of the production. SMT Gullwing Taping V DRM ...
Page 7
Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3-a Forward Current vs. Forward Voltage (Rank 1) 25˚C 0˚C 100 T =75˚ −25˚C 50˚ ...
Page 8
Fig.5 ON-state Voltage vs. Ambient Temperature 1.6 1.5 1.4 1.3 1.2 1.1 1 −40 − Ambient temperature T Fig.7 ON-state Current vs. ON-state Voltage 1.2 I =20mA F T =25˚ 0.8 0.6 0.4 0.2 ...
Page 9
Design Considerations ● Recommended Operating Conditions Parameter Input signal current Rank 1 Input at ON state Rank 2 Input signal current at OFF state PR26MF1xNSZ Load supply voltage PR36MF1xNSZ Output Load supply current Frequency Operating temperature ∗ ...
Page 10
Recommended Foot Print (reference) ● Standard Circuit Tr1 ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. SMT Gullwing Lead-form 8.2 2.2 (Unit : mm Load ...
Page 11
Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
Page 12
Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning ...
Page 13
Package specification ● Sleeve package Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. ...
Page 14
Tape and Reel package SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 ...
Page 15
Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...