SA58632 NXP Semiconductors, SA58632 Datasheet

SA58632

Manufacturer Part Number
SA58632
Description
Manufacturer
NXP Semiconductors
Datasheet

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SA58632BS
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AD
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1 001
1. General description
2. Features
3. Applications
The SA58632 is a two-channel audio amplifier in an HVQFN20 package. It provides
power output of 2.2 W per channel with an 8 Ω load at 9 V supply. The internal circuit is
comprised of two BTL (Bridge-Tied Load) amplifiers with a complementary PNP-NPN
output stage and standby/mute logic. The SA58632 is housed in a 20-pin HVQFN
package, which has an exposed die attach paddle enabling reduced thermal resistance
and increased power dissipation.
SA58632
2 × 2.2 W BTL audio amplifier
Rev. 02 — 4 March 2010
Low junction-to-ambient thermal resistance using exposed die attach paddle
Gain can be fixed with external resistors from 6 dB to 30 dB
Standby mode controlled by CMOS-compatible levels
Low standby current < 10 μA
No switch-on/switch-off plops
High power supply ripple rejection: 50 dB minimum
ElectroStatic Discharge (ESD) protection
Output short-circuit to ground protection
Thermal shutdown protection
Professional and amateur mobile radio
Portable consumer products: toys and games
Personal computer remote speakers
Product data sheet

Related parts for SA58632

SA58632 Summary of contents

Page 1

... W per channel with an 8 Ω load supply. The internal circuit is comprised of two BTL (Bridge-Tied Load) amplifiers with a complementary PNP-NPN output stage and standby/mute logic. The SA58632 is housed in a 20-pin HVQFN package, which has an exposed die attach paddle enabling reduced thermal resistance and increased power dissipation ...

Page 2

... THD total harmonic P distortion-plus-noise power supply rejection ratio Ordering information Name Description HVQFN20 plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 6 × 5 × 0.85 mm Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier Figure Min Typ 2 ∞ Ω [ ...

Page 3

... INL+ V CCL INR 13 INR+ V CCR SVR MODE 4 BTL/ n.c. GND GND Block diagram of SA58632 Rev. 02 — 4 March 2010 2 × 2.2 W BTL audio amplifier V V CCL CCR OUTL OUTL+ STANDBY/MUTE LOGIC 11 OUTR OUTR+ STANDBY/MUTE LOGIC 9 19 ...

Page 4

... Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier 16 OUTL 15 INL 14 INL+ SA58632BS 13 INR+ 12 INR 11 OUTR 002aac079 © NXP B.V. 2010. All rights reserved ...

Page 5

... NXP Semiconductors 8. Functional description The SA58632 is a two-channel BTL audio amplifier capable of delivering 2 × 1.5 W output power Ω load at THD using power supply also capable of delivering 2 × 2.2 W output power Ω load at THD using power supply. Using the MODE pin, the device can be switched to standby and mute condition. ...

Page 6

... Figure 3; unless otherwise specified. Min Typ 2 [ 1.5 - − 0 0.42 × SA58632 Unit °C ° Typ Unit 80 K/W [1] 22 K/W 3 K/W Max Unit μ 500 nA 500 nA 0.5 V − 1 μ ...

Page 7

... V; - 2.2 - 0.15 [ 100 [ [ [ [ Ω at the input. The ripple voltage Ω at the input. The ripple voltage SA58632 Max Unit - 0 kΩ μV 100 - μV 200 - dB © NXP B.V. 2010. All rights reserved ...

Page 8

... R2 × ------ - Gain left = × ------ - Gain right = 2 R3 Pins and 19 connected to ground. Application diagram of SA58632 BTL differential output configuration Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier = 20 dB, audio band-pass 100 OUTL OUTL+ 1 SA58632 ...

Page 9

... Band-pass = kHz versus V O MODE 002aac090 mute operating (V) CC SA58632 (Figure 4). 002aac089 (V) MODE © NXP B.V. 2010. All rights reserved ...

Page 10

... ( dB dB dB. v Channel separation versus frequency 002aac085 (1) (2) ( (Hz) SA58632 (Figure 7) 002aac084 (1) (2) ( (Hz) © NXP B.V. 2010. All rights reserved ...

Page 11

... Figure 23) has a 1 ounce copper heat spreader that runs under the Equation °C the maximum total power dissipation is given in amb = 4.1 W Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier K/W for the HVQFN20 package th(j-a) Equation (Figure 10) shows the power © ...

Page 12

... Figure 14) show the room temperature performance for SA58632 using Figure 23. For example, (a and b) show the performance as a function of load resistance and supply 13b shows that the part delivers 3.3 W per channel supply and 16 Ω ...

Page 13

... W BTL audio amplifier 3 (4) P (W) 2 (3) ( Ω kHz 002aac287 ( (V) CC SA58632 002aac289 (W) o © NXP B.V. 2010. All rights reserved ...

Page 14

... W BTL audio amplifier 2 10 (%) (1) (2) ( Ω kHz 002aac286 (3) ( (V) CC SA58632 002aac285 10 P (W) o © NXP B.V. 2010. All rights reserved ...

Page 15

... W BTL audio amplifier = 8 Ω dB; audio band-pass Figure 15. 100 OUTL 16 470 F OUTL+ 1 SA58632 C5 OUTR 11 470 F OUTR GND > 25 Ω) the SE L SA58632 V CC 100 002aac091 © NXP B.V. 2010. All rights reserved ...

Page 16

... Rev. 02 — 4 March 2010 2 × 2.2 W BTL audio amplifier 10 (%) ( Ω kHz 002aac292 (W) o SA58632 002aac291 ( (W) o © NXP B.V. 2010. All rights reserved ...

Page 17

... Fig 18. Channel separation versus frequency 002aac095 2 (W) 1.6 1.2 0.8 0 (Hz) (1) R (2) R (3) R Fig 20. P Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier (1) (2) (3) ( Ω, to buffer Ω. ...

Page 18

... Ω. ( Fig 21. Worst case power dissipation versus V SA58632_2 Product data sheet 4 P ( Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier 002aac097 (2) ( (V) CC © NXP B.V. 2010. All rights reserved ...

Page 19

... To improve the immunity of HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 kΩ); this creates a low-pass filter. 14.6 SA58632BS PCB demo The application demo board may be used for evaluation in either BTL or SE configuration as shown in the schematics in 64 ...

Page 20

... SA58632BS Rev5 Audio Amplifier GND OUTL GND VCC/2 VCC OUTR+ Fig 23. SA58632BS PCB demo VCC OUTL INL INR OUTR 100 001aae327 ...

Page 21

... 5.1 3.15 6.1 4.15 0.8 2.4 4.9 2.85 5.9 3.85 REFERENCES JEDEC JEITA MO-220 - - - Rev. 02 — 4 March 2010 2 × 2.2 W BTL audio amplifier A 1 detail 0.65 4 0.1 0.05 0.05 0.1 0.40 EUROPEAN PROJECTION SA58632 SOT910-1 c ISSUE DATE 05-10-11 © NXP B.V. 2010. All rights reserved ...

Page 22

... Solder bath specifications, including temperature and impurities SA58632_2 Product data sheet Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier © NXP B.V. 2010. All rights reserved ...

Page 23

... Lead-free process (from J-STD-020C) Package reflow temperature (°C) 3 Volume (mm ) < 350 260 260 250 Figure 25. Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier Figure 25) than a SnPb process, thus ≥ 350 220 220 350 to 2000 > 2000 260 260 250 245 ...

Page 24

... Bridge-Tied Load Complementary Metal Oxide Semiconductor Die Attach Paddle ElectroStatic Discharge Negative-Positive-Negative Printed-Circuit Board Positive-Negative-Positive Root Mean Squared Single-Ended Total Harmonic Distortion Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier peak temperature time 001aac844 © NXP B.V. 2010. All rights reserved ...

Page 25

... Data sheet status Change notice Product data sheet - characteristics”: Min. value for V I(BTL) Product data sheet - Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier Supersedes SA58632_1 changed from “2 V” to “0.42 × © NXP B.V. 2010. All rights reserved. ” ...

Page 26

... It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier © NXP B.V. 2010. All rights reserved ...

Page 27

... NXP Semiconductors’ product specifications. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 02 — 4 March 2010 SA58632 2 × 2.2 W BTL audio amplifier © NXP B.V. 2010. All rights reserved ...

Page 28

... Application information 13.1 BTL application . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 14.1 Static characterization 14.2 BTL dynamic characterization . . . . . . . . . . . . 10 14.3 Thermal behavior . . . . . . . . . . . . . . . . . . . . . . 11 14.4 Single-ended application . . . . . . . . . . . . . . . . 15 14.5 General remarks . . . . . . . . . . . . . . . . . . . . . . . 19 14.6 SA58632BS PCB demo . . . . . . . . . . . . . . . . . 19 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21 16 Soldering of SMD packages . . . . . . . . . . . . . . 22 16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 22 16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 22 16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24 18 Revision history ...

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