STPS745 STMicroelectronics, STPS745 Datasheet

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STPS745

Manufacturer Part Number
STPS745
Description
Power Schottky Rectifier
Manufacturer
STMicroelectronics
Datasheet

Specifications of STPS745

Insulated Package
TO-220FPAC

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Main product characteristics
Features and Benefits
Description
Single Schottky rectifier suited for Switch Mode
Power Supply and high frequency DC to DC
converters.
Packaged either in TO-220AC, TO-220FPAC or
D
voltage, high frequency inverters, free wheeling
and polarity protection applications.
March 2007
2
PAK, this device is intended for use in low
Very small conduction losses
Negligible switching losses
Extremely fast switching
Insulated package: TO-220FPAC
Insulating voltage = 2000 V DC
Capacitance = 12 pF
Avalanche capability specified
V
T
V
j
F
I
F(AV)
(max)
(max)
RRM
150° C
0.57 V
7.5
45
V
A
Rev 7
’’‘
STPS745D
TO-220AC
Power Schottky rectifier
K
A
A
STPS745G
K
D
2
PAK
NC
K
A
STPS745
TO-220FPAC
STPS745FP
www.st.com
K
A
1/9
9

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STPS745 Summary of contents

Page 1

... PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. March 2007 7 150° C 0.57 V ’’‘ Rev 7 STPS745 Power Schottky rectifier PAK STPS745G A K TO-220FPAC TO-220AC STPS745FP STPS745D A K 1/9 www.st.com 9 ...

Page 2

... T = 25° C 2700 j - 10000 Value 2 TO-220AC / D PAK 3.0 TO-220FPAC 5.5 Min. Typ RRM 7 0.65 F STPS745 Unit 7.5 A 150 °C 175 175 °C V/µs Unit °C/W Max. Unit 100 µ 0.57 0.84 V ...

Page 3

... STPS745 Figure 1. Average forward power dissipation versus average forward current P (W) F(AV) 6 δ = 0.1 δ = 0.2 δ (A) F(AV Figure 3. Normalized avalanche power derating versus pulse duration ARM p P (1µs) ARM 1 0.1 0.01 t (µs) p 0.001 0.01 0.1 1 Figure 5. Non repetitive surge peak forward ...

Page 4

... V ( ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35 µm) S(Cu)(cm² STPS745 T tp =tp/T 1E+1 F=1MHz V =30mV OSC RMS T =25° ...

Page 5

... STPS745 2 Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.55 Nm ● Maximum torque value: 0. Table 4. D PAK dimensions Figure 13. Footprint (dimensions in millimeters FLAT ZONE NO LESS THAN 2mm 16.90 10.30 8.90 Package information ...

Page 6

... Max. Min. A 4.4 4.6 0.173 B 2.5 2.7 0.098 D 2.5 2.75 0.098 E 0.45 0.70 0.018 F 0.75 1 0.030 F1 1.15 1.70 0.045 G 4.95 5.20 0.195 G1 2.4 2.7 0.094 H 10 10.4 0.393 L2 16 Typ. 0.63 Typ. L3 28.6 30.6 0.126 L4 9.8 10.6 0.386 L5 2.9 3.6 0.114 L6 15.9 16.4 0.626 L7 9.00 9.30 0.354 Dia. 3.00 3.20 0.118 STPS745 Inches Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 1.205 0.417 0.142 0.646 0.366 0.126 ...

Page 7

... STPS745 Table 6. TO-220AC dimensions H2 Ø order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...

Page 8

... Ordering information Ordering type STPS745D STPS745G STPS745G-TR STPS745FP 4 Revision history Date Jul-2003 22-Mar-2007 8/9 Marking Package STPS745D TO-220AC D PAK STPS745G 2 D PAK STPS745G 2 STPS745FP TO-220FPAC Revision Description of Changes 6G Last release. 7 Removed ISOWATT package. STPS745 Delivery Weight Base qty mode 1. Tube 1. Tube 1.48 g 1000 Tape & ...

Page 9

... STPS745 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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