STTH2003 STMicroelectronics, STTH2003 Datasheet

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STTH2003

Manufacturer Part Number
STTH2003
Description
Ultrafast Recovery Rectifier Diode
Manufacturer
STMicroelectronics
Datasheet

Specifications of STTH2003

Electrical Insulation
2000 V DC
Capacitance
12 pF

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Features
Description
Dual center tap fast recovery epitaxial diodes
suited for switch mode power supply and high
frequency DC/DC converters.
Packaged in TO-220AB, TO-220FPAB, I
D
secondary rectification.
September 2011
2
PAK, this device is especially intended for
Combines highest recovery and reverse
voltage performance
Ultra-fast, soft and noise-free recovery
Insulated package TO-220FPAB:
– Electrical insulation: 2000 V DC
– Capacitance: 12 pF
2
PAK or
Doc ID 5377 Rev 10
High frequency secondary rectifier
Table 1.
STTH2003CFP
TO-220FPAB
STTH2003CT
TO-220AB
V
Symbol
T
t
V
rr
j
F
I
F(AV)
(max)
A1
A2
(max)
RRM
(typ)
Device summary
A1
A1
K
K
A2
A2
STTH2003
STTH2003CG
K
STTH2003CR
D 2 PAK
2 x 10
K
175 °C
300
Value
35 ns
I 2 PAK
1 V
A1
V
A2
A
A1
www.st.com
K
A2
1/11
11

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STTH2003 Summary of contents

Page 1

... STTH2003CFP 2 PAK or TO-220AB STTH2003CT Table 1. Device summary Symbol I F(AV) V RRM T (max (max (typ) rr Doc ID 5377 Rev 10 STTH2003 PAK STTH2003CG PAK STTH2003CR Value 300 V 175 ° www.st.com 1/11 11 ...

Page 2

Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol V Repetitive peak reverse voltage RRM I Forward current rms F(RMS) Average forward current I δ = 0.5 F(AV) I Surge non repetitive forward current FSM I Non repetitive ...

Page 3

Table 5. Recovery characteristics Symbol Parameter t Reverse recovery time rr t Forward recovery time fr V Peak forward voltage FP I Reverse recovery current RM S factor Softness factor Figure 1. Conduction losses versus average forward current (per diode) ...

Page 4

Figure 5. Peak reverse recovery current versus dI /dt (90% confidence, per F diode =200V =125° F(AV F(AV =0.5 x ...

Page 5

Figure 11. Thermal resistance, junction to ambient, versus copper surface 2 under tab (D PAK) R (°C/W) th(j-a) 80 Printed circuit board FR4, 70 copper thickness: 35 µ (cm² ...

Page 6

Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending ...

Page 7

Devices in I PAK with nickel-plated back frame must NOT be mounted by frame soldering like SMDs. Such devices are intended to be through-hole mounted ONLY and in no circumstances shall ST be held liable for any lack of ...

Page 8

Table 8. TO-220AB dimensions H2 Dia 8/11 Ref ...

Page 9

Table 9. TO-220FPAB 3 leads in-line dimensions H Dia Doc ID 5377 Rev 10 Ref. Millimeters Min. A 4 2.45 E 0.4 F 0.6 ...

Page 10

... STTH2003CG STTH2003CG-TR STTH2003CFP STTH2003CR 4 Revision history Table 11. Document revision history Date Aug-2003 26-Mar-2007 11-Feb-2011 06-Sep-2011 10/11 Marking Package STTH2003CT TO-220AB 2 STTH2003CG D PAK 2 STTH2003CG D PAK STTH2003CFP TO-220FPAB 2 STTH2003CR I PAK Revision 7D Previous release. 8 Removed ISOWATT package. Updated base quantity for tape and reel delivery in ...

Page 11

... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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