TDA8591 PHILIPS [NXP Semiconductors], TDA8591 Datasheet

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TDA8591

Manufacturer Part Number
TDA8591
Description
4 X 44 W into 4 or 4 X 75 W into 2 quad BTL car radio power amplifier
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet

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Part Number:
TDA8591J
Manufacturer:
ST
0
Preliminary specification
File under Integrated Circuits, IC01
DATA SHEET
TDA8591J
4
into 2
amplifier
44 W into 4
quad BTL car radio power
INTEGRATED CIRCUITS
or 4
75 W
2002 Jan 14

Related parts for TDA8591

TDA8591 Summary of contents

Page 1

... DATA SHEET TDA8591J into 4 into 2 quad BTL car radio power amplifier Preliminary specification File under Integrated Circuits, IC01 INTEGRATED CIRCUITS 2002 Jan 14 ...

Page 2

... Jan into 16.1 16.2 16.3 16 Preliminary specification TDA8591J PACKAGE OUTLINE SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS ...

Page 3

... Bridge Tied Load (BTL) configuration. Each amplifier has a gain and supplies an output power (EIAJ) into a 2 load. The TDA8591J has low quiescent current and is primarily developed for car audio applications. PACKAGE DESCRIPTION plastic DIL-bent-SIL power package; 27 leads (lead length 7.7 mm) 3 Preliminary specifi ...

Page 4

... kHz (RMS see Fig. (p-p); mute or ripple operating mode see Fig.29 4 Preliminary specification TDA8591J MIN. TYP. MAX. UNIT 8.0 14.4 18.0 V 120 200 290 ...

Page 5

... V P TDA8591J INTERFACE 8 OFFSET DETECTION PGND1 PGND2 PGND3 PGND4 Fig.1 Block diagram. 5 Preliminary specification TDA8591J 3 OUT1 5 OUT1 9 OUT2 11 OUT2 14 CHARGE CP PUMP 19 OUT3 17 OUT3 25 OUT4 23 OUT4 6 DIAGNOSTIC DIAG 26 OFFCAP 24 27 MGW449 GNDHS ...

Page 6

... W into 2 handbook, halfpage 6 Preliminary specification TDA8591J SGND 2 OUT1 3 PGND1 4 OUT1 5 DIAG 6 PGND2 7 MUTE/ON 8 OUT2 9 IN1 10 OUT2 11 IN2 TDA8591J IN3 16 OUT3 17 IN4 18 OUT3 19 STBY 20 PGND3 21 22 CIN OUT4 23 PGND4 24 OUT4 25 OFFCAP 26 GNDHS 27 MGW450 Fig.2 Pin configuration. ...

Page 7

... Bridge Tied Load (BTL) amplifiers with high output power and low distortion. The gain of each amplifier is fixed at 26 dB. The TDA8591J has two-pin mode control which allows the amplifiers to be switched to standby (off) with the STBY pin, and the MUTE/ON pin to be used to switch between mute mode (input signal suppressed) and amplifier operating mode ...

Page 8

... DIAG amplifier output Pull-up resistor = 47 k Fig.4 Diagnostic waveforms: dynamic distortion detection function. short to short to GND DIAG V P amplifier 20 ms output GND Pull-up resistor = 47 k Fig.6 Diagnostic waveforms: short-circuit to V pin or GND. P TDA8591J MGT605 normal t (ms) MGU498 (ms) ...

Page 9

... R2 2 – Preliminary specification OFFSET DDD yes yes don’t care temperature diagnostic 1 short-circuit diagnostic dynamic distortion detection output offset diagnostic PGND Fig.7 Internal circuit diagnostic output pin DIAG. TDA8591J IN1 IN2 DIAG MGT610 ...

Page 10

... Fig.8 Connecting the DIAG output to a microcontroller input. 2002 Jan into 2 handbook, halfpage MICRO- CONTROLLER V R MGU513 handbook, halfpage MICRO- CONTROLLER IN1 MGU515 10 Preliminary specification TDA8591J V MICRO- CONTROLLER R DIAG MGU514 b. External pull-up DIAG IN2 MICRO- CONTROLLER IN1 R1 MGU516 ...

Page 11

... Therefore, the EIAJ power is defined and measured at the pins of the IC using the following test conditions: The supply voltage is 14.4 V measured on the pins of the TDA8591J All channels are loaded with 4 simultaneously The input signal is a continuous (no burst) square wave (RMS) ...

Page 12

... P EIAJ ( ( (1) P (infinite slew rate). EIAJ(max) (2) Maximum slew rate of TDA8591J. Fig.9 Comparison of sine wave and square wave RMS powers. 2002 Jan into 2 MGT612 MGT613 MGT614 ( Preliminary specification TDA8591J ...

Page 13

... V to guarantee 2000 0.75 mH (V) 14 2.5 ms 47.5 ms Fig.10 Load dump pulse definition. 13 Preliminary specification TDA8591J MIN. MAX + 150 55 +150 40 +85 ...

Page 14

... Fig.11 Equivalent thermal resistance network 14.4 V; measured in the circuit of Fig.29; unless otherwise specified CONDITIONS operating to mute mode mute to operating mode mute mode; V MUTE/ON operating mode; V MUTE/ON 14 Preliminary specification TDA8591J CONDITIONS VALUE 40 1 OUT4 2 K/W MGT602 MIN. TYP. 8.0 14.4 18.0 120 200 ...

Page 15

... T virtual junction temperature temperature pre-warning; vj Notes 1. With open MUTE/ON pin, the TDA8591J will switch to operating mode (see Section 7. the offset voltage across the load. Pin OFFCAP should never be left open-circuit. If pin OFFCAP is OO(det) connected to one of the PGND pins, the offset detection is switched off (see Section 14.4). ...

Page 16

... Preliminary specification MIN. TYP 41 0.03 0 (RMS 20000 25 150 300 TDA8591J MAX. UNIT 0 110 kHz ...

Page 17

... THD + N = 1%. Fig.15 Output power as a function of supply 17 Preliminary specification = kHz; 80 kHz filter 120 100 80 (1) 60 ( voltage TDA8591J MGW458 (Hz) MGW460 (V) ...

Page 18

... (1) Separation between channels 4 and 1. (2) Separation between channels 4 and 2. (3) Separation between channels 4 and 3. Fig.19 Channel separation as a function of 18 Preliminary specification TDA8591J frequency; channel 2 driven frequency; channel 4 driven. ...

Page 19

... Fig.23 Total harmonic distortion plus noise Preliminary specification (1) 1 (2) ( function of output power (1) ( function of frequency TDA8591J MGW467 ( MGW468 (Hz) ...

Page 20

... IEC60268 filtered noise; one channel driven. Fig.27 Power dissipation as a function of output 20 Preliminary specification power ( power TDA8591J MGW470 (W) MGW472 (W) ...

Page 21

... Philips Semiconductors into quad BTL car radio power amplifier 0 handbook, halfpage SVRR (dB (p-p). ripple Fig.28 Supply voltage ripple rejection as a function of frequency. 2002 Jan into 2 MGW473 (Hz) 21 Preliminary specification TDA8591J ...

Page 22

... V P TDA8591J INTERFACE 8 OFFSET DETECTION PGND1 PGND2 PGND3 Fig.29 Test circuit. 22 Preliminary specification TDA8591J V P 2200 F ( OUT1 3 OUT1 OUT2 9 OUT2 CHARGE PUMP 220 OUT3 19 OUT3 ...

Page 23

... Jan into 2 100 TDA8591J OUT IN OUT STBY GND Fig.30 Open ground pin test set-up. 100 TDA8591J OUT IN OUT STBY GND Fig.31 Open power supply (pin V 23 Preliminary specification TDA8591J (1) 14.4 V battery MGW453 (1) 14.4 V battery MGW454 ) test set-up. P ...

Page 24

... BTL car radio power amplifier handbook, full pagewidth 4700 F (1) Cable length is 1 metre, cable diameter is 1.5 mm. 2002 Jan into 2 100 H fuse TDA8591J OUT IN OUT e.g.BZW03C18 Fig.32 Reversed polarity power supply test set-up. 24 Preliminary specification V P (1) 14.4 V battery GND MGW455 TDA8591J ...

Page 25

... CIN 22 SGND 2 IN3 IN4 18 20 STBY INTERFACE 8 OFFSET DETECTION 2 (10 V) PGND1 PGND2 PGND3 25 Preliminary specification TDA8591J V P 2200 F ( OUT1 3 OUT1 OUT2 9 OUT2 CHARGE PUMP 220 OUT3 19 OUT3 ...

Page 26

... OUT1 3 OUT1 OUT2 9 OUT2 CHARGE PUMP 220 OUT3 19 OUT3 OUT4 25 OUT4 DIAG 6 DIAGNOSTIC to microcontroller OFFCAP 24 27 PGND4 GNDHS TDA8591J 220 k 220 220 k 220 MGW476 ...

Page 27

... Special attention should be paid to this f issue when selecting SMD capacitors at the four inputs (MKT capacitors are recommended). 14.2 Capacitors on outputs The TDA8591J is optimized for a capacitor from each output to ground for RF immunity and ESD. These capacitors can be replaced by the capacitors on the connector block. 14.3 EMC precautions The TDA8591J has an all N-type DMOS output stage ...

Page 28

... BTL car radio power amplifier 14.7 PCB layout handbook, full pagewidth GND 8-18V V P diag TDA8591J Dimensions in mm. 2002 Jan into 2 85.1 Out1 Out2 Out3 gnd float In1 In2 In3 In4 gnd Fig.35 PCB layout (component side). 28 Preliminary specification TDA8591J 39.4 2.2 F Out4 On Mute Off MGW474 ...

Page 29

... Dimensions in mm. 2002 Jan into 2 85.1 220 nF 220 220 k 220 k 220 Fig.36 PCB layout (soldering side). 29 Preliminary specification TDA8591J 39 GND V P 220 k MGW475 ...

Page 30

... V 2200 F (16 V) (1) 220 nF (2) 220 TDA8591J Fig.37 PCB design advice. 30 Preliminary specification TDA8591J 15 2 (6 ...

Page 31

... 30.4 28.0 12 2.0 1.0 4.0 29.9 27.5 11.8 REFERENCES JEDEC EIAJ 31 Preliminary specification non-concave view B: mounting base side 10.15 1.85 8.4 2.4 2.1 4.3 0.6 9.85 1.65 7.0 1.6 1.8 EUROPEAN PROJECTION TDA8591J SOT521 ( 2.4 0.25 0.03 45 1.8 ISSUE DATE 99-01-05 ...

Page 32

... If the temperature of the soldering iron bit is less than 300 C it may remain in contact for seconds. If the bit temperature is between 300 and 400 C, contact may seconds. SOLDERING METHOD DIPPING suitable 32 Preliminary specification TDA8591J ). If the stg(max) WAVE (1) suitable ...

Page 33

... Preliminary specification TDA8591J DEFINITIONS These products are not Philips Semiconductors ...

Page 34

... Philips Semiconductors into quad BTL car radio power amplifier 2002 Jan into 2 NOTES 34 Preliminary specification TDA8591J ...

Page 35

... Philips Semiconductors into quad BTL car radio power amplifier 2002 Jan into 2 NOTES 35 Preliminary specification TDA8591J ...

Page 36

Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited ...

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