ULN2004AP Toshiba, ULN2004AP Datasheet
ULN2004AP
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ULN2004AP Summary of contents
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... Package Type-APG: DIP-16pin Package Type-AFWG: SOL-16pin Input Base Type Resistor ULN2003APG/AFWG 2.7 kΩ ULN2004APG/AFWG 10.5 kΩ Pin Connection (top view) ULN2003,04APG/AFWG ULN2003APG ULN2004APG ULN2003AFWG ULN2004AFWG Weight DIP16−P-300-2.54A : 1.11 g (typ.) Designation SOL16−P-150-1.27A : 0.15 g (typ.) TTL CMOS 6~15 V PMOS, CMOS 1 2006-06-14 ...
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... Characteristic Output sustaining voltage Output current Input voltage Clamp diode reverse voltage Clamp diode forward current APG Power dissipation AFWG Operating temperature Storage temperature Note: On PCB (Test Board: JEDEC 2s2p) ULN2004APG/AFWG (Ta = 25°C) Symbol Rating Unit −0.5~ (SUS) I 500 mA/ch OUT − ...
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Recommended Operating Conditions Characteristic Output sustaining voltage APG Output current AFWG Input voltage ULN2003A Input voltage (output on) ULN2004A ULN2003A Input voltage (output off) ULN2004A Clamp diode reverse voltage Clamp diode forward current APG Power dissipation AFWG Note: On PCB ...
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Electrical Characteristics Characteristic Output leakage current Collector−emitter saturation voltage DC Current transfer ratio ULN2003A Input current (output on) ULN2004A Input current (output off) ULN2003A Input voltage (output on) ULN2004A Clamp diode reverse current Clamp ...
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Test Circuit CEX (OFF ULN2003,04APG/AFWG (sat (ON (ON 2006-06-14 ...
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ON OFF Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω Note 2: See below Input Condition Type Number ULN2003A ULN2004A Note 3: C includes probe and jig capacitance. L ...
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ULN2003,04APG/AFWG 7 2006-06-14 ...
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P – 2.00 (1) Type-APG free air 1.75 (2) Type-AFWG on PCB (Test Board: JEDEC 2s2p) (1) 1.50 (2) 1.25 1.00 0.75 0.50 0. 100 125 Ambient temperature Ta (°C) ULN2003,04APG/AFWG 150 8 ...
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Package Dimensions Weight: 1.11 g (typ.) ULN2003,04APG/AFWG 9 2006-06-14 ...
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Package Dimensions Weight: 0.15 g (typ.) ULN2003,04APG/AFWG 10 2006-06-14 ...
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Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
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Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
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... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...