vsc8115 Vitesse Semiconductor Corp, vsc8115 Datasheet

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vsc8115

Manufacturer Part Number
vsc8115
Description
Sts-12/sts-3 Multi Rate Clock And Data Recovery Unit
Manufacturer
Vitesse Semiconductor Corp
Datasheet

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VSC8115
Target Specification
9/29/00
G52272-0, Rev. 1.1
Features
General Description
speed timing signals. The VSC8115 recovers the clock from the scrambled NRZ data operating at 622.08Mb/s
(STS-12/OC-12/STM-4) or 155.52Mb/s (STS-3/OC-3/STM-1). After the clock is recovered, the data is retimed
using an output flip-flop. Both recovered clock and retimed data outputs can be configured as LVDS or
LVPECL signals to facilitate a low-jitter and low power interface.
VSC8115 Block Diagram
The VSC8115 functions as a clock and data recovery unit for SONET/SDH-based equipment to derive high
• Performs clock and data recovery for
• Meets Bellcore, ITU and ANSI Specifications
• 19.44MHz reference frequency LVTTL Input
• Lock Detect output pin monitors data run length
• Data is Retimed at the Output
• Active High Signal Detect LVPECL Input
DATAIN+/-
622.08Mb/s (STS-12/OC-12/STM-4) or
155.52Mb/s (STS-3/OC-3/STM-1) NRZ data
for Jitter Performance
and frequency drift from the reference clock
STS12
BYPASS
SD
LOCKREFN
REFCLK
2
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
Detector
Divider
Phase/
Freq
VITESSE
VITESSE SEMICONDUCTOR CORPORATION
SEMICONDUCTOR CORPORATION
CAP+
Loop Filter
CAP-
VCO
0
1
• Low-jitter high speed outputs can be configured
• Low power - 0.188 Watts Typical Power
• +3.3V Power Supply
• 20 Pin TSSOP Package
• Requires One External Capacitor
• PLL bypass operation facilitates the board
as either LVPECL or low power LVDS
debug process
Clock and Data Recovery Unit
STS-12/STS-3 Multi Rate
2
2
LOCKDET
DATAOUT+/-
CLKOUT+/-±
Page 1

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vsc8115 Summary of contents

Page 1

... The VSC8115 functions as a clock and data recovery unit for SONET/SDH-based equipment to derive high speed timing signals. The VSC8115 recovers the clock from the scrambled NRZ data operating at 622.08Mb/s (STS-12/OC-12/STM-4) or 155.52Mb/s (STS-3/OC-3/STM-1). After the clock is recovered, the data is retimed using an output flip-flop ...

Page 2

... Figure 1. If either one of these two inputs goes LOW and BYPASS is LOW, the VSC8115 will enter the loss of signal (LOS) state, and it will hold the DATAOUT+/- output at logic LOW state. During the LOS state, the VSC8115 also will hold the output clock CLKOUT+/- to within +500ppm of the REFCLK ...

Page 3

... Target Specification VSC8115 Figure 1: Control Diagram for Signal Detection and PLL Bypass Operation 2 DATAIN+/- PLL Clock (on-chip) REFCLK STS12 BYPASS LOCKREFN SD Table 1: Signal Detection and PLL Bypass Operation Control STS12 BYPASS G52272-0, Rev. 1.1 9/29/00 741 Calle Plano, Camarillo, CA 93012 • ...

Page 4

... VITESSE SEMICONDUCTOR CORPORATION Target Specification VSC8115 Units Conditions MHz ppm With respect to the fixed ppm reference frequency 20% Minimum transition density Valid REFCLK and device s already powered up 10% to 90%, with 100 & 5pF ...

Page 5

... Figure 2. The VSC8115 obtains and maintains lock based on the data transition information. When there is no transition on the data stream, the recovered clock frequency will be held to within +500ppm of the reference clock. The VSC8115 can maintain lock over 1000 bits of no switch- ing on data stream. ...

Page 6

... Page 6 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 VITESSE SEMICONDUCTOR CORPORATION ). STS-12 Operation Description (622.08MHz) VITESSE SEMICONDUCTOR CORPORATION Target Specification VSC8115 ) while the data valid time after su STS-3 Operation (155.52MHz) 450 pS 2.0 nS 650 pS 3.0 nS G52272-0, Rev. 1.1 9/29/00 ...

Page 7

... Target Specification VSC8115 DC Characteristics Table 4: LVPECL Single-ended Inputs and Outputs Parameters Description V Input HIGH voltage IH V Input LOW voltage IL I Input HIGH current IH I Input LOW current IL V Output LOW voltage OL V Output HIGH voltage OH Table 5: LVPECL Differential Inputs Parameters Description ...

Page 8

... Min Typ 1.12 - 400 - Min Typ Max 2.0 — VDD 0 — -50 --- -50 --- Description DD VITESSE SEMICONDUCTOR CORPORATION Target Specification VSC8115 Max Units Conditions 100 PAD to 1.7 V PADN 100 PAD to 750 mV PADN Max Units Conditions 50 to (VDD - 2V) 2 (VDD - 2V) 800 mV Units Conditions — ...

Page 9

... Target Specification VSC8115 Absolute Maximum Ratings Power Supply Voltage (V ) Potential to GND.................................................................................-0. Input Voltage (LVPECL Inputs)..................................................................................... -0. Input Voltage (LVTTL Inputs) ....................................................................................... -0. Output Current (LVDS or LVPECL Outputs).......................................................................................... +/-50mA Case Temperature Under Bias.........................................................................................................-55 Storage Temperature .................................................................................................................... -65 Maximum Input ESD (Human Body Model) High Speed Outputs (pins 11, 12, 13, & ...

Page 10

... Ground pin for low speed I/O’s and on-chip digital CMOS blocks +3.3V +3.3V Power Supply for high speed I/O’s and on-chip PLL blocks. GND Ground pins for high speed I/O’s and on-chip PLL blocks. VITESSE SEMICONDUCTOR CORPORATION Target Specification VSC8115 Pin Description G52272-0, Rev. 1.1 9/29/00 ...

Page 11

... Target Specification VSC8115 Package Information G52272-0, Rev. 1.1 9/29/00 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 VITESSE SEMICONDUCTOR CORPORATION TSSOP Package Drawings Key aaa b b1 bbb VITESSE SEMICONDUCTOR CORPORATION STS-12/STS-3 Multi Rate Clock and Data Recovery Unit ...

Page 12

... Clock and Data Recovery Unit Package Thermal Characteristics The VSC8115 is packaged in a Thin Shrink Small Outline Package (TSSOP). This package conforms to JEDEC package outline standards. It has hi-conductivity copper lead frames and a very low-stress mold com- pound. The junction to case thermal resistance is 80 single-layer PCB applications ...

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