x2816c ETC-unknow, x2816c Datasheet
x2816c
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x2816c Summary of contents
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... DESCRIPTION The Xicor X2816C advanced, high performance N-channel floating gate MOS technology. Like all Xicor Programmable nonvola- tile memories only device. The X2816C Control PP features the JEDEC approved pinout for byte-wide memories, compatible with industry standard RAMs, ROMs and EPROMs ...
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... X2816C PIN DESCRIPTIONS Addresses (A – The Address inputs select an 8-bit memory location during a read or write operation. Chip Enable (CE) The Chip Enable input must be LOW to enable all read/write operations. When CE is HIGH, power con- sumption is reduced. Output Enable (OE) The Output Enable input controls the data output buffers and is used to initiate read operations ...
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... HIGH. Write Write operations are initiated when both CE and WE are LOW and OE is HIGH. The X2816C supports both a CE and WE controlled write cycle. That is, the address is latched by the falling edge of either CE or WE, whichever occurs last. Similarly, the data is latched internally by the rising edge of either CE or WE, whichever occurs first ...
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... X2816C SYSTEM CONSIDERATIONS Because the X2816C is frequently used in large memory arrays provided with a two line control architecture for both read and write operations. Proper usage can provide the lowest possible power dissipation and elimi- nate the possibility of contention where multiple I/O pins share the same bus ...
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... X2816C ABSOLUTE MAXIMUM RATINGS* Temperature under Bias X2816C ....................................... – +85 C X2816CI ..................................... – +135 C Storage Temperature ....................... – +150 C Voltage on any Pin with Respect to V .................................. –1V to +7V SS D.C. Output Current ............................................. 5mA Lead Temperature (Soldering, 10 seconds) ...... 300 C RECOMMENDED OPERATING CONDITIONS Temperature Min. ...
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... X2816C ENDURANCE AND DATA RETENTION Parameter Minimum Endurance Data Retention POWER-UP TIMING Symbol PUR (3) t Power-Up to Read Operation PUW (3) t Power-Up to Write Operation CAPACITANCE 1MHz Symbol I/O (3) C Input/Output Capacitance IN (3) C Input Capacitance A.C. CONDITIONS OF TEST Input Pulse Levels ...
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... OLZ t LZ DATA VALID are periodically sampled and not 100% tested X2816C-15 X2816C-20 Max. Min. Max. Min. Max. 150 200 120 150 200 120 150 200 60 80 100 ...
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... X2816C-90 Min OEH DATA VALID t DS HIGH Z 8 X2816C-12,-15,-20 Max. Min. Max 100 0 0 100 10 10 100 50 100 100 100 1 100 3852 PGM T09.1 ...
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... X2816C CE Controlled Write Cycle ADDRESS OES DATA IN DATA OUT Page Mode Write Cycle ( (7) ADDR. * I/O BYTE 0 *For each successive write within the page write operation –A 10 should be the same or writes to an unknown address could occur. ...
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... X2816C DATA Polling Timing Diagram (10) ADDRESS I/O 7 Note: (10) Polling operations are by definition read cycles and are therefore subject to read cycle timings OEH D OUT = SYMBOL TABLE WAVEFORM OES OUT =X 3852 FHD F08 INPUTS OUTPUTS Must be ...
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... X2816C Normalized Active Supply Current vs. Ambient Temperature 1 1.2 1.0 0.8 0.6 –55 +25 AMBIENT TEMPERATURE ( C) Normalized Access Time vs. Ambient Temperature 1 1.2 1.0 0.8 0.6 –55 +25 AMBIENT TEMPERATURE ( C) Normalized Standby Supply Current vs. Ambient Temperature 1.4 1.2 1.0 0.8 0.6 +125 –55 3852 FHD F09.1 +125 3852 FHD F11 +25 +125 AMBIENT TEMPERATURE ( C) 3852 FHD F10.1 ...
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... X2816C PACKAGING INFORMATION 24-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P PIN 1 INDEX PIN 1 SEATING PLANE 0.150 (3.81) 0.125 (3.18) 0.110 (2.79) 0.090 (2.29) TYP. 0.010 (0.25) NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 1.265 (32.13) 1.230 (31.24) 1.100 (27.94) REF. 0.065 (1.65) 0.022 (0.56) 0.040 (1.02) 0.014 (0.36) 0.625 (15.87) 0.600 (15.24) ...
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... X2816C PACKAGING INFORMATION 32-LEAD PLASTIC LEADED CHIP CARRIER PACKAGE TYPE J 0.420 (10.67) 0.045 (1.14 0.495 (12.57) 0.485 (12.32) TYP. 0.490 (12.45) 0.453 (11.51) 0.447 (11.35) TYP. 0.450 (11.43) 0.300 (7.62) REF. PIN 1 NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. DIMENSIONS WITH NO TOLERANCE FOR REFERENCE ONLY 0.050" TYPICAL 0.510" TYPICAL 0.400" ...
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... X2816C PACKAGING INFORMATION 32-PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE E 0.300 (7.62) 0.015 (0.38) 0.003 (0.08) PIN 1 0.200 (5.08) BSC 0.028 (0.71) 0.022 (0.56) (32) PLCS. 0.458 (11.63) 0.442 (11.22) 0.458 (11.63) NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. TOLERANCE: 1% NLT 0.005 (0.127) BSC 0.150 (3.81) BSC 0.020 (0.51 REF. 0.095 (2.41) 0.075 (1.91) 0.022 (0.56) DIA ...
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... X2816C PACKAGING INFORMATION 24-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S PIN 1 INDEX PIN 1 (4X) 7 0.050 (1.27) 0.010 (0.25) 0.020 (0.50) 0 – 8 0.015 (0.40) 0.050 (1.27) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 0.014 (0.35) 0.020 (0.50) 0.598 (15.20) 0.610 (15.49 0.009 (0.22) 0.420" 0.013 (0.33) FOOTPRINT 15 0.290 (7.37) 0.393 (10.00) 0.299 (7.60) 0.420 (10.65) 0.092 (2.35) ...
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... X2816C ORDERING INFORMATION Device X2816C Access Time –90 = 90ns –12 = 120ns –15 = 150ns –20 = 200ns Temperature Range Blank = Commercial = + Industrial = – +85 C Package P = 24-Lead Plastic DIP J = 32-Lead PLCC E = 32-Pad LCC S = 24-Lead Plastic SOIC 16 ...