PESD5V0S4UF,115 NXP Semiconductors, PESD5V0S4UF,115 Datasheet - Page 8

• Manufacturer Part Number: PESD5V0S4UF,115
• Description: DIODE QUAD ESD PROTECTION 6-XSON
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PESD5V0S4UF,115

• Package / Case: 6-XSON (Micropak™), SOT-886
• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 6.46V
• Power (watts): 110W
• Polarization: 4 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Channels: 4 Channels
• Clamping Voltage: 12 V
• Operating Voltage: 5 V
• Breakdown Voltage: 6.8 V
• Peak Surge Current: 10 A
• Peak Pulse Power Dissipation: 110 W
• Capacitance: 85 pF
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.05(Max) mm W x 1.5(Max) mm L
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934061201115; PESD5V0S4UF T/R; PESD5V0S4UF T/R

NXP Semiconductors
7. Application information
PESD3V3S4UF_PESD5V0S4UF_1
Product data sheet
The PESDxS4UF is designed for the protection of up to four unidirectional data or signal
lines from the damage caused by ESD and surge pulses. The PESDxS4UF may be used
on lines where the signal polarities are either positive or negative with respect to ground.
The PESDxS4UF provides a surge capability of 110 W per line for an 8/20 s waveform
each.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESDxS4UF as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
Fig 9. Application diagram
ground loops.
vias.
Rev. 01 — 17 January 2008
PESD3V3S4UF; PESD5V0S4UF
unidirectional protection
1
2
3
of 4 lines
Unidirectional quadruple ESD protection diode arrays
DUT
6
5
4
n.c.
bidirectional protection
data- or transmission lines
1
2
3
of 3 lines
DUT
006aab128
6
5
4
n.c.
© NXP B.V. 2008. All rights reserved.
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