PIC12F635-I/P Microchip Technology, PIC12F635-I/P Datasheet - Page 175

• Manufacturer Part Number: PIC12F635-I/P
• Description: IC MCU FLASH 1KX14 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
• Minimum Operating Temperature: - 40 C
• Data Rom Size: 128 B
• Height: 3.3 mm
• Length: 9.27 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

15.5
© 2007 Microchip Technology Inc.
DC CHARACTERISTICS
D001
D001A
D002
D003
D003A
D004
D005
D006
D007
D008
Note 1:
Param
No.
*
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
DC Characteristics: PIC16F639-I (Industrial)
V
V
V
V
V
S
V
R
R
I
AIL
Sym
DD
DDT
DR
POR
PORT
VDD
BOD
M
PU
These parameters are characterized but not tested.
only and are not tested.
This is the limit to which V
Supply Voltage
Supply Voltage (AFE)
RAM Data Retention
Voltage
V
ensure internal Power-on
Reset signal
V
to ensure internal Power-
on Reset signal
V
internal Power-on Reset
signal
Brown-out Reset
Turn-on Resistance or
Modulation Transistor
Digital Input Pull-Up
Resistor
CS, SCLK
Analog Input Leakage
Current
DD
DD
DD
Start Voltage to
Start Voltage (AFE)
Rise Rate to ensure
Characteristic
(1)
LCX, LCY, LCZ
LCCOM
DD
can be lowered in Sleep mode without losing RAM data.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C
0.05*
1.5*
Min Typ† Max Units
2.0
2.0
2.0
50
—
—
—
—
—
PIC12F635/PIC16F636/639
V
200
2.1
50
—
—
—
—
—
—
—
SS
100
350 kOhm V
3.6
3.6
1.8
2.2
±1
±1
—
—
—
V/ms See Section 12.3 “Power-on Reset” for
Ohm V
V
V
V
V
V
V
A
A
F
Analog Front-End V
V
Device in Sleep mode
See Section 12.3 “Power-on Reset” for
details.
Analog Front-End POR voltage.
details.
V
Sleep mode
OSC
DD
DD
DD
DD
in this document.
= 3.0V
= 3.6V
= 3.6V, V
T
A
10 MHz
+85°C for industrial
SS
Conditions
V
DD
IN
voltage. Treated as
DS41232D-page 173
V
DD
, tested at