ATMEGA48-20PU Atmel, ATMEGA48-20PU Datasheet - Page 29

IC AVR MCU 4K 20MHZ 5V 28DIP

ATMEGA48-20PU

Manufacturer Part Number
ATMEGA48-20PU
Description
IC AVR MCU 4K 20MHZ 5V 28DIP
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA48-20PU

Core Processor
AVR
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
4KB (2K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Processor Series
ATMEGA48x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
2-Wire/SPI/USART/Serial
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
23
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
Cpu Family
ATmega
Device Core
AVR
Device Core Size
8b
Frequency (max)
20MHz
Total Internal Ram Size
512Byte
# I/os (max)
23
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
28
Package Type
PDIP
For Use With
ATSTK600-TQFP32 - STK600 SOCKET/ADAPTER 32-TQFPATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVRATAVRISP2 - PROGRAMMER AVR IN SYSTEMATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
2545S–AVR–07/10
Figure 8-2.
The Low Power Oscillator can operate in three different modes, each optimized for a specific fre-
quency range. The operating mode is selected by the fuses CKSEL3..1 as shown in
on page
Table 8-3.
Notes:
The CKSEL0 Fuse together with the SUT1..0 Fuses select the start-up times as shown in
8-4.
Table 8-4.
Oscillator Source /
Power Conditions
Ceramic resonator, fast
rising power
Ceramic resonator, slowly
rising power
Ceramic resonator, BOD
enabled
Ceramic resonator, fast
rising power
Ceramic resonator, slowly
rising power
Frequency Range
1. This is the recommended CKSEL settings for the different frequency ranges.
2. This option should not be used with crystals, only with ceramic resonators.
3. If 8 MHz frequency exceeds the specification of the device (depends on V
29.
8.0 - 16.0
0.4 - 0.9
0.9 - 3.0
3.0 - 8.0
(MHz)
Fuse can be programmed in order to divide the internal frequency by 8. It must be ensured
that the resulting divided clock meets the frequency specification of the device.
Crystal Oscillator Connections
Low Power Crystal Oscillator Operating Modes
Start-up Times for the Low Power Crystal Oscillator Clock Selection
Start-up Time from
Power-down and
Power-save
258 CK
258 CK
1K CK
1K CK
1K CK
Capacitors C1 and C2 (pF)
C2
C1
Recommended Range for
12 - 22
12 - 22
12 - 22
Additional Delay
14CK + 4.1 ms
14CK + 4.1 ms
14CK + 65 ms
14CK + 65 ms
(V
from Reset
XTAL2
XTAL1
GND
CC
14CK
= 5.0V)
(3)
ATmega48/88/168
(2)
(1)
(2)
(1)
(2)
CKSEL0
CC
0
0
0
0
1
CKSEL3..1
), the CKDIV8
100
101
110
111
(2)
Table 8-3
SUT1..0
(1)
00
01
10
11
00
Table
29

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