PIC16F627-04/SO Microchip Technology, PIC16F627-04/SO Datasheet - Page 129

IC MCU FLASH 1KX14 COMP 18SOIC

PIC16F627-04/SO

Manufacturer Part Number
PIC16F627-04/SO
Description
IC MCU FLASH 1KX14 COMP 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheet

Specifications of PIC16F627-04/SO

Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
4MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
18-SOIC (7.5mm Width)
Controller Family/series
PIC16F
No. Of I/o's
16
Eeprom Memory Size
128Byte
Ram Memory Size
224Byte
Cpu Speed
4MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
224 B
Interface Type
SCI, USART
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
3 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F627-04/SO
Manufacturer:
MIC
Quantity:
933
Part Number:
PIC16F627-04/SO
Manufacturer:
MICROCHI
Quantity:
20 000
17.0
Absolute Maximum Ratings†
Ambient temperature under bias................................................................................................................. -40 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on MCLR and RA4 with respect to V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by PORTA and PORTB....................................................................................................200 mA
Maximum current sourced by PORTA and PORTB ..............................................................................................200 mA
Note 1: Power dissipation is calculated as follows: P
 2003 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
ELECTRICAL SPECIFICATIONS
Voltage spikes below V
a series resistor of 50-100
this pin directly to V
DD
with respect to V
IK
(1)
OK
(V
DD
.....................................................................................................................................800 mW
SS
I
(Vo < 0 or Vo >V
< 0 or V
pin ..............................................................................................................................250 mA
pin ...........................................................................................................................300 mA
SS
SS
SS
I
> V
............................................................................................................ -0.3 to +6.5V
at the MCLR pin, inducing currents greater than 80 mA, may cause latchup. Thus,
DD
should be used when applying a “low” level to the MCLR pin rather than pulling
SS
)..................................................................................................................... ± 20 mA
DD
SS
....................................................................................-0.3V to V
)............................................................................................................... ± 20 mA
............................................................................................-0.3 to +14V
Preliminary
DIS
= V
DD
x {I
DD
- ∑ I
OH
} + ∑ {(V
DD
-V
PIC16F62X
OH
) x I
OH
DS40300C-page 127
} + ∑(V
O
DD
l x I
+ 0.3V
OL
)

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