PIC16F627-04/SO Microchip Technology, PIC16F627-04/SO Datasheet - Page 75

IC MCU FLASH 1KX14 COMP 18SOIC

PIC16F627-04/SO

Manufacturer Part Number
PIC16F627-04/SO
Description
IC MCU FLASH 1KX14 COMP 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheet

Specifications of PIC16F627-04/SO

Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
4MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
18-SOIC (7.5mm Width)
Controller Family/series
PIC16F
No. Of I/o's
16
Eeprom Memory Size
128Byte
Ram Memory Size
224Byte
Cpu Speed
4MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
224 B
Interface Type
SCI, USART
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
3 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F627-04/SO
Manufacturer:
MIC
Quantity:
933
Part Number:
PIC16F627-04/SO
Manufacturer:
MICROCHI
Quantity:
20 000
The data on the RB1/RX/DT pin is sampled three times
by a majority detect circuit to determine if a high or a
low level is present at the RX pin. If bit BRGH
(TXSTA<2>) is clear (i.e., at the low baud rates), the
sampling is done on the seventh, eighth and ninth
falling edges of a x16 clock (Figure 12-3). If bit BRGH
is set (i.e., at the high baud rates), the sampling is done
on the 3 clock edges preceding the second rising edge
after the first falling edge of a x4 clock (Figure 12-4 and
Figure 12-5).
FIGURE 12-1:
FIGURE 12-2:
FIGURE 12-3:
 2003 Microchip Technology Inc.
Q2, Q4 CLK
Baud CLK
(RB1/RX/DT pin)
x4 CLK
RX pin
baud CLK
x16 CLK
RX
RX PIN SAMPLING SCHEME. BRGH = 0
RX PIN SAMPLING SCHEME, BRGH = 1
Q2, Q4 clk
RX PIN SAMPLING SCHEME, BRGH = 1
RX pin
baud clk
1
x4 clk
2
First falling edge after RX pin goes low
3
1
4
5
1
START Bit
Samples
First falling edge after RX pin goes low
6
2
Preliminary
Samples
7
Samples
Second rising edge
3
START Bit
8
2
4
Second rising edge
9
START bit
1
Samples
10
Baud CLK for all but START bit
Bit0
2
11
Baud CLK for all but START bit
12
3
3
13
4
14
1
Samples
PIC16F62X
Bit1
15
2
16
1
DS40300C-page 73
4
2
Bit0
3
Bit0

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