PIC16F627-04/SO Microchip Technology, PIC16F627-04/SO Datasheet - Page 95

• Manufacturer Part Number: PIC16F627-04/SO
• Description: IC MCU FLASH 1KX14 COMP 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F627-04/SO

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 224 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC16F
• No. Of I/o's: 16
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 224Byte
• Cpu Speed: 4MHz
• No. Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 224 B
• Interface Type: SCI, USART
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 3 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Data Converters: -
• Lead Free Status / Rohs Status: Details

14.2
14.2.1
The PIC16F62X can be operated in eight different
oscillator options. The user can program three
configuration bits (FOSC2 thru FOSC0) to select one of
these eight modes:
• LP
• XT
• HS
• ER
• INTRC Internal Resistor/Capacitor (2 modes)
• EC
14.2.2
In XT, LP or HS modes a crystal or ceramic resonator
is connected to the OSC1 and OSC2 pins to establish
oscillation (Figure 14-1). The PIC16F62X oscillator
design requires the use of a parallel cut crystal. Use of
a series cut crystal may give a frequency out of the
crystal manufacturers specifications. When in XT, LP or
HS modes, the device can have an external clock
source to drive the OSC1 pin (Figure 14-4).
FIGURE 14-1:
 2003 Microchip Technology Inc.
Note
1:
2:
C1
C2
Oscillator Configurations
Low Power Crystal
Crystal/Resonator
High Speed Crystal/Resonator
External Resistor (2 modes)
External Clock In
OSCILLATOR TYPES
CRYSTAL OSCILLATOR / CERAMIC
RESONATORS
A series resistor may be required for some crys-
tals.
See Table 14-1 and Table 14-2 for recommended
values of C1 and C2.
NOTE 1
XTAL
RS
OSC1
OSC2
CRYSTAL OPERATION
(OR CERAMIC
RESONATOR) (HS, XT OR
LP OSC
CONFIGURATION)
RF
SLEEP
PIC16F62X
F
OSC
Preliminary
TABLE 14-1:
TABLE 14-2:
14.2.3
Either a prepackaged oscillator can be used, or a
simple oscillator circuit with TTL gates can be built.
Prepackaged oscillators provide a wide operating
range and better stability. A well-designed crystal
oscillator will provide good performance with TTL
gates. Two types of crystal oscillator circuits can be
used; one with series resonance, or one with parallel
resonance.
Figure 14-2 shows implementation of a parallel
resonant oscillator circuit. The circuit is designed to use
the fundamental frequency of the crystal. The 74AS04
inverter performs the 180° phase shift that a parallel
oscillator requires. The 4.7 kΩ resistor provides the
negative
potentiometers bias the 74AS04 in the linear region.
This could be used for external oscillator designs.
Note
Note
Mode
Mode
HS
XT
HS
LP
XT
1:
1:
Ranges Characterized:
Higher capacitance increases the stability of the oscilla-
tor but also increases the start-up time. These values
are for design guidance only. Since each resonator has
its own characteristics, the user should consult the res-
onator manufacturer for appropriate values of external
components.
Higher capacitance increases the stability of the oscilla-
tor but also increases the start-up time. These values
are for design guidance only. Rs may be required in HS
mode as well as XT mode to avoid overdriving crystals
with low drive level specification. Since each crystal
has its own characteristics, the user should consult the
crystal manufacturer for appropriate values of external
components.
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
feedback
16.0 MHz
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
200 kHz
100 kHz
10 MHz
20 MHz
Freq
32 kHz
2 MHz
4 MHz
8 MHz
Freq
CAPACITOR SELECTION FOR
CERAMIC RESONATORS
CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR
for
PIC16F62X
22 - 100 pF
OSC1(C1)
15 - 68 pF
15 - 68 pF
10 - 68 pF
10 - 22 pF
68 - 100 pF
68 - 150 pF
OSC1(C1)
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
stability.
DS40300C-page 93
The
150 - 200 pF
22 - 100 pF
68 - 100 pF
OSC2(C2)
15 - 68 pF
15 - 68 pF
10 - 68 pF
10 - 22 pF
OSC2(C2)
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
10 kΩ