PIC16LF87-I/P Microchip Technology, PIC16LF87-I/P Datasheet - Page 210
PIC16LF87-I/P
Manufacturer Part Number
PIC16LF87-I/P
Description
IC MCU FLASH 4KX14 EEPROM 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16LF627A-IP.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16F87-IP.pdf
(228 pages)
4.PIC16F87-IP.pdf
(8 pages)
5.PIC16F87-IP.pdf
(4 pages)
6.PIC16F87-IP.pdf
(8 pages)
Specifications of PIC16LF87-I/P
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Core Processor
PIC
Speed
10MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Controller Family/series
PIC16LF
No. Of I/o's
16
Eeprom Memory Size
256Byte
Ram Memory Size
368Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
SSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16LF87-I/P
Manufacturer:
Microchip
Quantity:
720
- PIC16LF627A-IP PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16F87-IP PDF datasheet #3
- PIC16F87-IP PDF datasheet #4
- PIC16F87-IP PDF datasheet #5
- PIC16F87-IP PDF datasheet #6
- Current page: 210 of 228
- Download datasheet (5Mb)
PIC16F87/88
18-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
DS30487C-page 208
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
c
D
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
18
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
2005 Microchip Technology Inc.
NOM
p
18
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15
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