DSPIC30F2012-30I/SP Microchip Technology, DSPIC30F2012-30I/SP Datasheet - Page 55
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DSPIC30F2012-30I/SP
Manufacturer Part Number
DSPIC30F2012-30I/SP
Description
IC DSPIC MCU/DSP 12K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20ISO.pdf
(210 pages)
3.DSPIC30F2011-20ISO.pdf
(14 pages)
4.DSPIC30F2011-20ISO.pdf
(6 pages)
5.DSPIC30F2011-20ISO.pdf
(18 pages)
6.DSPIC30F2012-30ISO.pdf
(205 pages)
7.DSPIC30F2011-20IP.pdf
(206 pages)
Specifications of DSPIC30F2012-30I/SP
Program Memory Type
FLASH
Program Memory Size
12KB (4K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
1 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Core Frequency
30MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
20
Flash Memory Size
12KB
Supply Voltage Range
2.5V To 5.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F201230ISP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2012-30I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
TABLE 12-1:
© 2010 Microchip Technology Inc.
Step 8: Set the read pointer (W6) and load the (next four write) latches.
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
Step 9: Repeat Steps 7-8 eight times to load the write latches for the 32 instructions.
Step 10: Unlock the NVMCON for programming.
0000
0000
0000
0000
Step 11: Initiate the programming cycle.
0000
0000
0000
—
0000
0000
0000
0000
0000
Step 12: Reset the device internal PC.
0000
0000
Step 13: Repeat Steps 7-12 until all 23 rows of executive memory are programmed.
Command
(Binary)
EB0300
000000
BB0BB6
000000
000000
BBDBB6
000000
000000
BBEBB6
000000
000000
BB1BB6
000000
000000
BB0BB6
000000
000000
BBDBB6
000000
000000
BBEBB6
000000
000000
BB1BB6
000000
000000
200558
883B38
200AA9
883B39
A8E761
000000
000000
—
000000
000000
A9E761
000000
000000
040100
000000
(Hexadecimal)
PROGRAMMING THE PROGRAMMING EXECUTIVE (CONTINUED)
Data
CLR
NOP
TBLWTL
NOP
NOP
TBLWTH.B
NOP
NOP
TBLWTH.B
NOP
NOP
TBLWTL
NOP
NOP
TBLWTL
NOP
NOP
TBLWTH.B
NOP
NOP
TBLWTH.B
NOP
NOP
TBLWTL
NOP
NOP
MOV
MOV
MOV
MOV
BSET NVMCON, #15
NOP
NOP
Externally time ‘P12a’ ms (see
Timing
NOP
NOP
BCLR NVMCON, #15
NOP
NOP
GOTO 0x100
NOP
Requirements”)
W6
[W6++], [W7]
[W6++], [W7++]
[W6++], [++W7]
[W6++], [W7++]
[W6++], [W7]
[W6++], [W7++]
[W6++], [++W7]
[W6++], [W7++]
#0x55, W8
W8, NVMKEY
#0xAA, W9
W9, NVMKEY
Description
Section 13.0 “AC/DC Characteristics and
DS70102K-page 55