DSPIC30F2010-20I/MM Microchip Technology, DSPIC30F2010-20I/MM Datasheet - Page 148
DSPIC30F2010-20I/MM
Manufacturer Part Number
DSPIC30F2010-20I/MM
Description
IC DSPIC MCU/DSP 12K 28QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2010-20ISO.pdf
(202 pages)
3.DSPIC30F2010-20ISO.pdf
(18 pages)
4.DSPIC30F2010-20ISO.pdf
(6 pages)
5.DSPIC30F2010-20ISO.pdf
(26 pages)
6.DSPIC30F2010-20IMM.pdf
(204 pages)
Specifications of DSPIC30F2010-20I/MM
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
20
Flash Memory Size
12KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F2010-20I/MMG
DSPIC30F201020IMM
DSPIC30F201020IMM
DSPIC30F201020IMM
DSPIC30F201020IMM
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2010-20ISO PDF datasheet #2
- DSPIC30F2010-20ISO PDF datasheet #3
- DSPIC30F2010-20ISO PDF datasheet #4
- DSPIC30F2010-20ISO PDF datasheet #5
- DSPIC30F2010-20IMM PDF datasheet #6
- Current page: 148 of 202
- Download datasheet (3Mb)
dsPIC30F2010
22.1
TABLE 22-1:
TABLE 22-2:
TABLE 22-3:
DS70118J-page 148
dsPIC30F2010-30I
dsPIC30F2010-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 28-pin QFN
Package Thermal Resistance, 28-pin SPDIP (SP)
Note 1:
V
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
DC Characteristics
P
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
INT
I
Junction to ambient thermal resistance, Theta-ja (
/
O
=
Range
=
∑
V
(
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
{
V
×
DD
⎛
⎝
–
I
DD
V
Characteristic
OH
–
∑
} I
Rating
×
I
OH
OH
⎞
⎠
)
-40°C to 125°C
-40°C to 125°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
Temp Range
+
∑
(
V
O L
×
I
OL
)
θ
JA
dsPIC30F2010-30I
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
P
T
T
T
T
30
20
10
—
—
JA
JA
JA
A
A
D
J
J
48.3
33.7
Min
Typ
-40
-40
-40
-40
42
Max MIPS
(T
© 2011 Microchip Technology Inc.
P
J
INT
- T
Max
Typ
—
—
—
—
—
—
—
+ P
A
dsPIC30F2010-20E
)/
θ
I
/
O
JA
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
20
15
—
—
—
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
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