ATMEGA328P-AU Atmel, ATMEGA328P-AU Datasheet - Page 549

• Manufacturer Part Number: ATMEGA328P-AU
• Description: MCU AVR 32K FLASH 32TQFP
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA328P-AU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-TQFP, 32-VQFP
• Processor Series: ATMEGA32x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: 2-Wire, SPI, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: ATmega
• Device Core: AVR
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 2KB
• # I/os (max): 23
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 1.8V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: TQFP
• Controller Family/series: AVR MEGA
• No. Of I/o's: 23
• Eeprom Memory Size: 1KB
• Ram Memory Size: 2KB
• Cpu Speed: 20MHz
• Rohs Compliant: Yes
• For Use With: ATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVR
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ATMEGA328P-20AU; ATMEGA328P-20AU; Q3790246

34.2
8271D–AVR–05/11
A1 BALL CORNER
Note2:
Note1:
32CC1
solder resist layer.
to the seating plane.
Dimension “b1” is the solderable surface defined by the opening of the
Dimension “b” is measured at the maximum ball dia. in a plane parallel
Package Drawing Contact:
[e-mail]
D1
A
B
C
D
E
F
F
E
D
C
B
A
1 2 3 4 5 6
1 2 3 4 5 6
BOTTOM VIEW
TOP VIEW
E1
E
Pin#1 ID
TITLE
32CC1, 32-ball (6 x 6 Array), 4 x 4 x 0.6 mm
package, ball pitch 0.50 mm, Ultra Thin,
Fine-Pitch Ball Grid Array (UFBGA)
e
ATmega48A/PA/88A/PA/168A/PA/328/P
e
D
32-Øb
SYMBOL
A
A1
A2
b
b1
D
D1
E
E1
e
0.12
0.25
0.25
3.90
3.90
MIN
b1
COMMON DIMENSIONS
GPC
SIDE VIEW
(Unit of Measure = mm)
–
CAG
A1
0.38 REF
0.08
2.50 BSC
2.50 BSC
0.50 BSC
NOM
0.30
4.00
4.00
A
–
–
–
DRAWING NO.
A2
32CC1
MAX
0.60
0.35
4.10
4.10
–
–
NOTE
07/06/10
1
2
REV.
B
549