DSPIC30F3013-30I/SO Microchip Technology, DSPIC30F3013-30I/SO Datasheet - Page 174

• Manufacturer Part Number: DSPIC30F3013-30I/SO
• Description: IC DSPIC MCU/DSP 24K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3013-30I/SO

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 30
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301330ISO

dsPIC30F2011/2012/3012/3013
FIGURE 20-14:
TABLE 20-31: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
DS70139G-page 174
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
No.
Note: Refer to
2:
3:
(CKP = 0)
(CKP = 1)
SDI
SDI
SCK
SDO
SS
SCK
X
X
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ
X
X
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPI pins.
X
TscH2ssH
TscL2ssH
Symbol
Figure 20-3
SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SP50
SCK
SCK
SCK
SCK
SDO
SDO
SDO
SCK
Setup Time of SDI
to SCK
Hold Time of SDI
to SCK
SS
SS
high impedance
SS
X
X
X
↓ to SCK
↑ to SDO
SP35
X
X
X
X
X
X
X
X
after SCK Edge
SP71
Input Low Time
Input High Time
Input Fall Time
Input Rise Time
Edge
Data Output Fall Time
Data Output Rise Time
Data Output Valid after
X
X
Characteristic
for load conditions.
Edge
Edge
SP40
X
MSb IN
↑ or SCK
X
MSb
SP41
SP70
(3)
Output
X
X
Data Input
Data Input
(3)
SP30,SP31
(3)
(1)
X
↓ Input
(3)
(3)
BIT 14 - - - - - -1
BIT 14 - - - -1
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
1.5 T
Min
120
+40
30
30
20
20
10
—
—
—
—
—
CY
SP73
SP72
Typ
—
10
10
—
—
—
—
—
—
—
—
—
(2)
SP72
SP73
LSb
LSb IN
SP52
Max
25
25
30
50
—
—
—
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
© 2010 Microchip Technology Inc.
SP51
A
A
Units
≤ +85°C for Industrial
≤ +125°C for Extended
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
See
See
Conditions
DO32
DO31
—
—
—
—
—
—
—
—
—
—