PIC18F2410-I/ML Microchip Technology, PIC18F2410-I/ML Datasheet - Page 355

• Manufacturer Part Number: PIC18F2410-I/ML
• Description: IC PIC MCU FLASH 8KX16 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2410-I/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• For Use With: XLT28QFN4 - SOCKET TRANS ICE 28QFN W/CABLEAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

© 2009 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
D
A
E
K
e
b
L
E2
1
2
0.80
0.00
3.65
3.65
0.23
0.50
0.20
MIN
N
PIC18F2X1X/4X1X
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
DS39636D-page 357
b
K
e