DSPIC33FJ16GS502-I/SO Microchip Technology, DSPIC33FJ16GS502-I/SO Datasheet - Page 23

IC DSPIC MCU/DSP 16K 28-SOIC

DSPIC33FJ16GS502-I/SO

Manufacturer Part Number
DSPIC33FJ16GS502-I/SO
Description
IC DSPIC MCU/DSP 16K 28-SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ16GS502-I/SO

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
21
Flash Memory Size
16KB
Supply Voltage Range
3V To 3.6V
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
8-chx10-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ16GS502-I/SO
Manufacturer:
MICROCHIP
Quantity:
11 200
Part Number:
DSPIC33FJ16GS502-I/SO
Manufacturer:
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Part Number:
DSPIC33FJ16GS502-I/SO
Manufacturer:
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2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging
purposes. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will
communications to the device. If such discrete
components are an application requirement, they
should be removed from the circuit during program-
ming and debugging. Alternatively, refer to the AC/DC
characteristics and timing requirements information in
the respective device Flash programming specification
for information on capacitive loading limits and pin input
voltage high (V
Ensure that the “Communication Channel Select”
(i.e., PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
ICE™.
For more information on ICD 2, ICD 3, and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip website.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
© 2009 Microchip Technology Inc.
Guide” DS51331
User's Guide” DS51616
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
interfere
®
ICSP Pins
ICD 2, MPLAB
®
®
®
®
ICD 2 In-Circuit Debugger User's
ICD 2 Design Advisory” DS51566
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Debugger
IH
) and input low (V
®
®
®
with
ICD 2” (poster) DS51265
ICD 3” (poster) DS51765
REAL ICE™” (poster) DS51749
the
®
ICD 3, or MPLAB
programmer/debugger
IL
) requirements.
®
REAL
Preliminary
2.6
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
FIGURE 2-3:
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
DS70318D-page 21
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