PIC18F2510-I/SP Microchip Technology, PIC18F2510-I/SP Datasheet - Page 358
PIC18F2510-I/SP
Manufacturer Part Number
PIC18F2510-I/SP
Description
IC MCU FLASH 16KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18LF2410-ISO.pdf
(376 pages)
4.PIC18LF2410-ISO.pdf
(8 pages)
5.PIC18LF2410-ISO.pdf
(16 pages)
6.PIC18LF2410-ISO.pdf
(6 pages)
7.PIC18LF2410-ISO.pdf
(6 pages)
8.PIC18LF2410-ISO.pdf
(8 pages)
9.PIC18F2510-ISP.pdf
(378 pages)
Specifications of PIC18F2510-I/SP
Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
25
Program Memory Type
FLASH
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
25
Ram Memory Size
1.5KB
Cpu Speed
40MHz
No. Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F2510-I/SP
Manufacturer:
TM
Quantity:
50 000
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18LF2410-ISO PDF datasheet #3
- PIC18LF2410-ISO PDF datasheet #4
- PIC18LF2410-ISO PDF datasheet #5
- PIC18LF2410-ISO PDF datasheet #6
- PIC18LF2410-ISO PDF datasheet #7
- PIC18LF2410-ISO PDF datasheet #8
- PIC18F2510-ISP PDF datasheet #9
- Current page: 358 of 378
- Download datasheet (7Mb)
PIC18F2X1X/4X1X
DS39636C-page 356
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
A2
1.980
MIN
.125
.015
.590
.485
.115
.008
.030
.014
E1
–
–
L
.100 BSC
INCHES
NOM
40
Microchip Technology Drawing C04-016B
–
–
–
–
–
–
–
–
–
–
–
© 2007 Microchip Technology Inc.
eB
E
2.095
MAX
.625
.070
.023
.250
.195
.580
.200
.015
.700
–
c
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