PIC16F873A-I/SS Microchip Technology, PIC16F873A-I/SS Datasheet - Page 21
PIC16F873A-I/SS
Manufacturer Part Number
PIC16F873A-I/SS
Description
IC MCU FLASH 4KX14 EE 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F873A-ISO.pdf
(234 pages)
4.PIC16F873A-ISO.pdf
(6 pages)
5.PIC16F873A-ISO.pdf
(4 pages)
6.PIC16F873A-ISO.pdf
(6 pages)
7.PIC16F873A-ISO.pdf
(4 pages)
8.PIC16F873A-ISO.pdf
(22 pages)
Specifications of PIC16F873A-I/SS
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
128Byte
Ram Memory Size
192Byte
Cpu Speed
20MHz
No. Of Timers
3
Core
PIC
Processor Series
PIC16F
Data Bus Width
8 bit
Maximum Clock Frequency
20 MHz
Data Ram Size
192 B
Data Rom Size
128 B
On-chip Adc
Yes
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Mounting Style
SMD/SMT
A/d Bit Size
10 bit
A/d Channels Available
5
Height
1.75 mm
Interface Type
I2C, SPI, USART
Length
10.2 mm
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
5.3 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164307 - MODULE SKT FOR PM3 28SSOPAC164020 - MODULE SKT PROMATEII 44TQFPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Lead Free Status / Rohs Status
Details
Other names
PIC16F873AI/SS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F873A-I/SS
Manufacturer:
Microchip Technology
Quantity:
1 812
Part Number:
PIC16F873A-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F873A-ISO PDF datasheet #3
- PIC16F873A-ISO PDF datasheet #4
- PIC16F873A-ISO PDF datasheet #5
- PIC16F873A-ISO PDF datasheet #6
- PIC16F873A-ISO PDF datasheet #7
- PIC16F873A-ISO PDF datasheet #8
- Current page: 21 of 688
- Download datasheet (3Mb)
1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1
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