DSPIC30F3011-30I/PT Microchip Technology, DSPIC30F3011-30I/PT Datasheet - Page 227

• Manufacturer Part Number: DSPIC30F3011-30I/PT
• Description: IC DSPIC MCU/DSP 24K 44TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3011-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 30
• Eeprom Size: 1K x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Data Ram Size: 1024 B
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011, DM300018
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFPAC164305 - MODULE SKT FOR PM3 44TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301130IPT

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2010 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F3010AT-30I/PT = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 3 0 1 0 AT- 3 0 I / P F - 0 0 0
dsPIC30F3010/3011
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
PT = TQFP 10x10
PT = TQFP 12x12
P
SO = SOIC
SP = SPDIP
ML = QFN (8x8)
S
W
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= DIP
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70141F-page 227
Speed
20 = 20 MIPS
30 = 30 MIPS