PIC18LF2550-I/SP Microchip Technology, PIC18LF2550-I/SP Datasheet - Page 337
PIC18LF2550-I/SP
Manufacturer Part Number
PIC18LF2550-I/SP
Description
IC PIC MCU FLASH 16KX16 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XR1.pdf
(438 pages)
3.PIC18F2221-ISO.pdf
(46 pages)
4.PIC18F2455-ISO.pdf
(14 pages)
5.PIC18F2455-ISO.pdf
(8 pages)
6.PIC18F2455-ISO.pdf
(26 pages)
7.PIC18F4550-IP.pdf
(430 pages)
8.PIC18LF2455-ISO.pdf
(430 pages)
Specifications of PIC18LF2550-I/SP
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI/I2C/EAUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163025, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PCM18XR1 PDF datasheet #2
- PIC18F2221-ISO PDF datasheet #3
- PIC18F2455-ISO PDF datasheet #4
- PIC18F2455-ISO PDF datasheet #5
- PIC18F2455-ISO PDF datasheet #6
- PIC18F4550-IP PDF datasheet #7
- PIC18LF2455-ISO PDF datasheet #8
- Current page: 337 of 430
- Download datasheet (7Mb)
NEGF
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
© 2007 Microchip Technology Inc.
Q Cycle Activity:
Before Instruction
After Instruction
Decode
REG
REG
Q1
=
=
register ‘f’
Negate f
NEGF
0 ≤ f ≤ 255
a ∈ [0,1]
(f) + 1 → f
N, OV, C, DC, Z
Location ‘f’ is negated using two’s
complement. The result is placed in the
data memory location ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank (default).
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f ≤ 95 (5Fh). See
Section 26.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
1
1
NEGF
Read
0110
Q2
0011 1010 [3Ah]
1100 0110 [C6h]
f {,a}
REG, 1
110a
Process
Data
Q3
ffff
register ‘f’
PIC18F2455/2550/4455/4550
Write
Q4
ffff
Preliminary
NOP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
None.
Q Cycle Activity:
Decode
Q1
operation
No Operation
NOP
None
No operation
None
No operation.
1
1
0000
1111
No
Q2
0000
xxxx
operation
No
Q3
DS39632D-page 335
0000
xxxx
operation
No
Q4
0000
xxxx
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