PIC18F2320-I/SP Microchip Technology, PIC18F2320-I/SP Datasheet - Page 369
PIC18F2320-I/SP
Manufacturer Part Number
PIC18F2320-I/SP
Description
IC MCU FLASH 4KX16 EEPROM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F1320-ISS.pdf
(36 pages)
3.PIC18F2220-ISO.pdf
(394 pages)
4.PIC18F2220-ISO.pdf
(6 pages)
5.PIC18F2220-ISO.pdf
(6 pages)
6.PIC18F2220-ISO.pdf
(8 pages)
7.PIC18F2220-ISO.pdf
(6 pages)
8.PIC18F2220-ISO.pdf
(6 pages)
9.PIC18F2220-ISP.pdf
(388 pages)
Specifications of PIC18F2320-I/SP
Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SPI/I2C/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
5
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F1320-ISS PDF datasheet #2
- PIC18F2220-ISO PDF datasheet #3
- PIC18F2220-ISO PDF datasheet #4
- PIC18F2220-ISO PDF datasheet #5
- PIC18F2220-ISO PDF datasheet #6
- PIC18F2220-ISO PDF datasheet #7
- PIC18F2220-ISO PDF datasheet #8
- PIC18F2220-ISP PDF datasheet #9
- Current page: 369 of 388
- Download datasheet (7Mb)
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
2003 Microchip Technology Inc.
A1
Number of Contacts
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Drawing No. C04-103
*Controlling Parameter
Notes:
1.
2.
3. Contact profiles may vary.
4.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: M0-220
OPTIONAL PIN 1
TOP MARKING
INDEX ON
Dimension Limits
TOP VIEW
E
DETAIL: CONTACT VARIANTS
(PROFILE MAY VARY)
Units
(A3)
D2
E2
A1
n
p
A
E
D
B
L
n
PIC18F2220/2320/4220/4320
EXPOSED PAD
MIN
2
1
.000
.246
.246
.008
.014
.309
.309
.031
INDEX ON
(A3)
D
.026 BSC
.010 REF
PIN 1
A
INCHES
NOM
D2
.035
.315
.268
.315
.268
.013
.016
.001
44
1
2
EXPOSED
MAX
.274
.274
.039
.002
.013
.019
.321
.321
METAL
BOTTOM VIEW
PAD
MIN
E2
0.80
7.85
6.25
7.85
6.25
0.20
0.35
0
MILLIMETERS*
0.65 BSC
0.25 REF
NOM
0.90
0.02
8.00
6.80
8.00
6.80
0.33
0.40
44
L
1
2
DS39599C-page 367
MAX
B
1.00
0.05
8.15
6.95
8.15
6.95
0.35
0.48
p
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