DSPIC33FJ128MC506A-I/MR Microchip Technology, DSPIC33FJ128MC506A-I/MR Datasheet - Page 21

IC DSPIC MCU/DSP 128K 64-QFN

DSPIC33FJ128MC506A-I/MR

Manufacturer Part Number
DSPIC33FJ128MC506A-I/MR
Description
IC DSPIC MCU/DSP 128K 64-QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet

Specifications of DSPIC33FJ128MC506A-I/MR

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Product
DSCs
Processor Series
DSPIC33F
Core
dsPIC
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
2.0
2.1
G ettin g
dsPIC33FJXXXMCX06A/X08A/X10A family of 16-bit
Digital Signal Controllers (DSC) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
 2009 Microchip Technology Inc.
(see Section 2.2 “Decoupling Capacitors”)
is not used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
REF
CAP
DD
+/V
/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source.
of the dsPIC33FJXXXMCX06A/X08A/
X10A family of devices. It is not intended
to be a comprehensive reference source.
To complement the information in this
data sheet, refer to the “dsPIC33F/
PIC24H
which is available from the Microchip web
site (www.microchip.com).
described in this section may not be avail-
able on all devices. Refer to Section 4.0
“Memory Organization” in this data
sheet for device-specific register and bit
information.
- pins used when external voltage
CAP
SS
star ted
SS
pins
/V
DD
DDCORE
pins (regardless if ADC module
Family
and AV
dsPIC33FJXXXMCX06A/X08A/X10A
)”)
Reference
SS
w ith
pins must be
Manual”,
t he
Preliminary
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high-frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 F (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high-frequency noise, upward of
tens of MHz, add a second ceramic type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 F in parallel with 0.001 F.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB track
inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70594B-page 21
SS
, AV
DD
and

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