DSPIC33FJ128GP310A-I/PT Microchip Technology, DSPIC33FJ128GP310A-I/PT Datasheet - Page 26

IC DSPIC MCU/DSP 128K 100-TQFP

DSPIC33FJ128GP310A-I/PT

Manufacturer Part Number
DSPIC33FJ128GP310A-I/PT
Description
IC DSPIC MCU/DSP 128K 100-TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet

Specifications of DSPIC33FJ128GP310A-I/PT

Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
100-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 2-1:
2.2.1
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that con-
nects the power supply source to the device, and the
maximum current drawn by the device in the applica-
tion. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3
A low-ESR (< 5 Ohms) capacitor is required on the
V
voltage regulator output voltage. The V
pin must not be connected to V
capacitor between 4.7 µF and 10 µF, 16V connected to
ground. The type can be ceramic or tantalum. Refer to
Section 25.0
additional information.
The placement of this capacitor should be close to the
V
length not exceed one-quarter inch (6 mm). Refer to
Section 22.2 “On-Chip Voltage Regulator” for
details.
DS70593B-page 26
CAP
CAP
Ceramic
V
0.1 µF
DD
R
/V
/V
C
DDCORE
DDCORE
R1
Capacitor on Internal Voltage
Regulator (V
TANK CAPACITORS
10 
MCLR
V
V
SS
DD
. It is recommended that the trace
“Electrical
pin, which is used to stabilize the
RECOMMENDED
MINIMUM CONNECTION
dsPIC33F
CAP
Ceramic
0.1 µF
/V
Characteristics”
DD
DDCORE
, and must have a
V
V
CAP
DD
SS
Ceramic
0.1 µF
Ceramic
0.1 µF
)
/V
Ceramic
0.1 µF
DDCORE
Preliminary
for
2.4
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device programming and debugging
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (V
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
Note 1: R  10 k is recommended. A suggested
example,
2: R1  470 will limit any current flowing into
Master Clear (MCLR) Pin
V
starting value is 10 k. Ensure that the MCLR
pin V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
IH
DD
R
JP
and V
C
IH
as
and V
IL
shown
EXAMPLE OF MCLR PIN
CONNECTIONS
specifications are met.
R1
 2009 Microchip Technology Inc.
IL
IH
specifications are met.
and V
MCLR
in
dsPIC33F
IL
Figure 2-2,
) and fast signal
it
is

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