DSPIC33FJ128GP708-I/PT Microchip Technology, DSPIC33FJ128GP708-I/PT Datasheet - Page 23

• Manufacturer Part Number: DSPIC33FJ128GP708-I/PT
• Description: IC DSPIC MCU/DSP 128K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP708-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 80-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 69
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 69
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164328 - MODULE SKT FOR 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

58. Module: UART
59. Module: I/O
60. Module: SPI
© 2010 Microchip Technology Inc.
The UART module will not generate consecutive
break characters. Trying to perform a back-to-back
Break character transmission will cause the UART
module to transmit the dummy character used to
generate the first Break character instead of
transmitting the second Break character. Break
characters are generated correctly if they are
followed by non-Break character transmission.
Work around
None.
Affected Silicon Revisions
While the device is being programmed via the
PGECx/PGEDx pin pair, the device pin with SDO1
functionality may start toggling.
Work around
None.
Affected Silicon Revisions
Regardless of the Slave setting for the Frame
delay bit (FRMDLY = 0 or FRMDLY = 1), the Slave
always acts as if the sync pulse precedes the first
SPI data bit (FRMDLY = 0). The SPI will not
function as described if Slave FRMDLY = 1.
Work around
None.
Affected Silicon Revisions
A2
A2
A2
X
X
X
A3
A3
A3
X
X
X
A4
A4
A4
X
X
X
61. Module: ADC
If the ADC module is in an enabled state when the
device enters Sleep mode as a result of executing
a PWRSAV #0 instruction, the device power-down
current (I
in the device data sheet. This may happen even if
the ADC module is disabled by clearing the ADON
bit prior to entering Sleep mode.
Work around
In order to remain within the I
listed in the device data sheet, the user software
must completely disable the ADC module by
setting the ADC Module Disable bit in the
corresponding Peripheral Module Disable register
(PMDx), prior to executing a PWRSAV
instruction.
Affected Silicon Revisions
A2
X
A3
X
PD
) may exceed the specifications listed
A4
X
DS80446D-page 23
PD
specifications
#0