LPC1754FBD80,551 NXP Semiconductors, LPC1754FBD80,551 Datasheet - Page 65

IC ARM CORTEX MCU 128K 80-LQFP

LPC1754FBD80,551

Manufacturer Part Number
LPC1754FBD80,551
Description
IC ARM CORTEX MCU 128K 80-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1754FBD80,551

Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
80-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
52
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 6x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
52
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 6 Channel
On-chip Dac
10 bit
Cpu Family
LPC17xx
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
32KB
# I/os (max)
52
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4/2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4790
935287913551

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LPC1754FBD80,551
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Manufacturer:
NXP Semiconductors
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NXP Semiconductors
LPC1759_58_56_54_52_51
Product data sheet
14.3 XTAL Printed-Circuit Board (PCB) layout guidelines
Table 21.
Table 22.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
Fundamental oscillation
frequency F
5 MHz - 10 MHz
10 MHz - 15 MHz
15 MHz - 20 MHz
Fundamental oscillation
frequency F
15 MHz - 20 MHz
20 MHz - 25 MHz
1 MHz - 5 MHz
Fig 33. Oscillator modes and models: oscillation mode of operation and external crystal
model used for C
Recommended values for C
components parameters): low frequency mode
Recommended values for C
components parameters): high frequency mode
OSC
OSC
All information provided in this document is subject to legal disclaimers.
XTALIN
C X1
LPC1xxx
Rev. 6.01 — 11 March 2011
XTAL
X1
Crystal load
capacitance C
10 pF
20 pF
30 pF
10 pF
20 pF
30 pF
10 pF
20 pF
10 pF
Crystal load
capacitance C
10 pF
20 pF
10 pF
20 pF
/C
X2
XTALOUT
evaluation
C X2
X1
X1
LPC1759/58/56/54/52/51
/C
/C
L
L
X2
X2
in oscillation mode (crystal and external
in oscillation mode (crystal and external
Maximum crystal
series resistance R
< 300 Ω
< 300 Ω
< 300 Ω
< 300 Ω
< 200 Ω
< 100 Ω
< 160 Ω
< 60 Ω
< 80 Ω
Maximum crystal
series resistance R
< 180 Ω
< 100 Ω
< 160 Ω
< 80 Ω
32-bit ARM Cortex-M3 microcontroller
=
x1
S
S
, C
L
C L
R S
x2
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
002aaf424
, and C
© NXP B.V. 2011. All rights reserved.
C P
x3
in case of
X1
X1
/C
,
65 of 74
CX2
X2

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