LPC1764FBD100,551 NXP Semiconductors, LPC1764FBD100,551 Datasheet - Page 4

• Manufacturer Part Number: LPC1764FBD100,551
• Description: IC ARM CORTEX MCU 128K 100-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1764FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC17
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 3
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME, IRD-LPC1768-DEV, KSK-LPC1768-JL
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• On-chip Dac: 10 bit
• Package: 100LQFP
• Device Core: ARM Cortex M3
• Family Name: LPC1700
• Maximum Speed: 100 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4793; 935287919551

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
Table 2.
LPC1769_68_67_66_65_64_63
Product data sheet
Type number
LPC1769FBD100
LPC1768FBD100
LPC1768FET100
LPC1767FBD100
LPC1766FBD100
LPC1765FBD100
LPC1764FBD100
LPC1763FBD100
Type number
LPC1769FBD100 512 kB 32
LPC1768FBD100 512 kB 32
LPC1768FET100 512 kB 32
LPC1767FBD100 512 kB 32
LPC1766FBD100 256 kB 32
LPC1765FBD100 256 kB 32
LPC1764FBD100 128 kB 16
LPC1763FBD100 256 kB 32
Ordering information
Ordering options
4.1 Ordering options
Flash
Package
Name
LQFP100
LQFP100
TFBGA100
LQFP100
LQFP100
LQFP100
LQFP100
LQFP100
SRAM in kB
CPU AHB
eMetering
Lighting
Industrial networking
16
SRAM0
16
16
16
16
16
16
16
Description
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm SOT926-1
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
All information provided in this document is subject to legal disclaimers.
AHB
SRAM1
16
16
16
16
16
16
-
16
Rev. 6.01 — 11 March 2011
Total
64
64
64
64
64
64
32
64
LPC1769/68/67/66/65/64/63
Ethernet USB
yes
yes
no
yes
yes
yes
yes
no
Device/Host/OTG 2
Device/Host/OTG 2
Device/Host/OTG 2
no
Device/Host/OTG 2
Device/Host/OTG 2
Device only
no
Alarm systems
White goods
Motor control
32-bit ARM Cortex-M3 microcontroller
CAN I
no
2
no
yes yes
yes yes
yes yes
yes yes
yes yes
yes yes
no
yes yes
2
S
© NXP B.V. 2011. All rights reserved.
no
DAC Maximum
CPU
operating
frequency
120 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
Version
SOT407-1
SOT407-1
SOT407-1
SOT407-1
SOT407-1
SOT407-1
SOT407-1
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