LPC1764FBD100,551 NXP Semiconductors, LPC1764FBD100,551 Datasheet - Page 45

• Manufacturer Part Number: LPC1764FBD100,551
• Description: IC ARM CORTEX MCU 128K 100-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1764FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC17
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 3
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME, IRD-LPC1768-DEV, KSK-LPC1768-JL
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• On-chip Dac: 10 bit
• Package: 100LQFP
• Device Core: ARM Cortex M3
• Family Name: LPC1700
• Maximum Speed: 100 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4793; 935287919551

NXP Semiconductors
Table 7.
T
LPC1769_68_67_66_65_64_63
Product data sheet
Symbol
I
I
Standard port pins, RESET, RTCK
I
I
I
V
V
V
V
V
V
V
I
I
I
I
I
I
DD(ADC)
I(ADC)
IL
IH
OZ
OH
OL
OHS
OLS
pd
pu
amb
I
O
IH
IL
hys
OH
OL
=
−
40
°
Static characteristics
C to +85
Parameter
ADC supply current
ADC input current
LOW-level input current V
HIGH-level input
current
OFF-state output
current
input voltage
output voltage
HIGH-level input
voltage
LOW-level input voltage
hysteresis voltage
HIGH-level output
voltage
LOW-level output
voltage
HIGH-level output
current
LOW-level output
current
HIGH-level short-circuit
output current
LOW-level short-circuit
output current
pull-down current
pull-up current
°
C, unless otherwise specified.
…continued
All information provided in this document is subject to legal disclaimers.
Conditions
active mode;
deep sleep mode
power-down mode
deep power-down mode
on pin VREFP
resistor disabled
V
pull-down resistor
disabled
V
on-chip pull-up/down
resistors disabled
pin configured to provide
a digital function
output active
I
I
V
V
V
V
V
V
V
OH
OL
I
I
O
OH
OL
OH
OL
I
I
DD(3V3)
ADC powered
ADC in Power-down
mode
deep sleep mode
power-down mode
deep power-down
mode
= 0 V; on-chip pull-up
= V
= 5 V
= 0 V
= 0 V; V
= 4 mA
= −4 mA
= 0.4 V
= V
= V
= 0 V
DD(3V3)
Rev. 6.01 — 11 March 2011
DD(3V3)
DD(3V3)
< V
O
I
; on-chip
< 5 V
= V
− 0.4 V
DD(3V3)
LPC1769/68/67/66/65/64/63
;
[13][14]
[13][15]
[17][18]
[13]
[13]
[13]
[16]
[16]
[16]
[19]
[20]
[20]
32-bit ARM Cortex-M3 microcontroller
Min
-
-
-
-
-
-
-
-
-
-
-
0
0
0.7V
-
0.4
V
0.4
-
−4
4
-
-
10
−15
0
DD(3V3)
DD(3V3)
−
-
Typ
1.95
<0.2
38
38
24
100
100
100
0.5
0.5
0.5
-
-
-
-
-
-
-
-
-
-
50
−50
0
[1]
© NXP B.V. 2011. All rights reserved.
Max
-
-
-
-
-
-
-
-
10
10
10
5.0
V
-
0.3V
-
-
0.4
-
-
−45
50
150
−85
0
DD(3V3)
DD(3V3)
45 of 79
Unit
mA
μA
nA
nA
nA
nA
nA
nA
nA
nA
nA
V
V
V
V
V
V
V
mA
mA
mA
mA
μA
μA
μA