LPC2458FET180,551 NXP Semiconductors, LPC2458FET180,551 Datasheet - Page 387
LPC2458FET180,551
Manufacturer Part Number
LPC2458FET180,551
Description
IC ARM7 MCU FLASH 512K 180TFBGA
Manufacturer
NXP Semiconductors
Series
LPC2400r
Specifications of LPC2458FET180,551
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
136
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
180-TFBGA
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
32 bit
Data Ram Size
98 KB
Interface Type
CAN, Ethernet, I2C, I2S, IrDA, SPI, SSP, UART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
136
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA180
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
On-chip Dac
10 bit, 1 Channel
Package
180TFBGA
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
For Use With
622-1023 - BOARD SCKT ADAPTER FOR TFBGA180622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
568-4258
935282454551
LPC2458FET180-S
935282454551
LPC2458FET180-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2458FET180,551
Manufacturer:
MICROCHIP
Quantity:
1 103
Company:
Part Number:
LPC2458FET180,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
- Current page: 387 of 792
- Download datasheet (5Mb)
NXP Semiconductors
UM10237_4
User manual
10. Software tests the FE bit and finds that the active buffer (B_2) is empty (FE=0).
11. Both B_1 and B_2 are empty. Software waits for the next endpoint interrupt to occur.
The following example illustrates how double buffering works for a Bulk IN endpoint in
Slave mode:
Assume that both buffer 1 (B_1) and buffer 2 (B_2) are empty and that the active buffer is
B_1. The interrupt on NAK feature is enabled.
10. Software has no more packets to send, so it simply clears the interrupt.
5. Software sends the SIE Select Endpoint command to read the Select Endpoint
6. The host resends the third packet which device hardware places in B_1. An endpoint
7. Software finishes reading the second packet from B_2 and sends a SIE Clear Buffer
8. Software responds to the endpoint interrupt by clearing it and begins reading the third
9. Software finishes reading the third packet from B_1 and sends a SIE Clear Buffer
1. The host requests a data packet by sending an IN token packet. The device responds
2. Software clears the endpoint interrupt. The device has three packets to send.
3. Software sends the SIE Select Endpoint command to read the Select Endpoint
4. Software waits for the endpoint interrupt to occur.
5. The device successfully sends the packet in B_1 and clears the buffer. An endpoint
6. Software clears the endpoint interrupt. Software fills B_1 with the third packet and
7. The device successfully sends the second packet from B_2 and generates an
8. Software has no more packets to send, so it simply clears the interrupt.
9. The device successfully sends the third packet from B_1 and generates an endpoint
Register and test the FE bit. Software finds that the active buffer (B_2) has data
(FE=1). Software clears the endpoint interrupt and begins reading the contents of
B_2.
interrupt is generated.
command to free B_2 to receive another packet. B_1 becomes the active buffer.
Software waits for the next endpoint interrupt to occur (it already has been generated
back in step 6).
packet from B_1.
command to free B_1 to receive another packet. B_2 becomes the active buffer.
The active buffer is now B_2. The next data packet sent by the host will be placed in
B_2.
with a NAK and generates an endpoint interrupt.
Software fills B_1 with the first packet and sends a SIE Validate Buffer command. The
active buffer is switched to B_2.
Register and test the FE bit. It finds that B_2 is empty (FE=0) and fills B_2 with the
second packet. Software sends a SIE Validate Buffer command, and the active buffer
is switched to B_1.
interrupt occurs.
validates it using the SIE Validate Buffer command. The active buffer is switched to
B_2.
endpoint interrupt.
interrupt.
Rev. 04 — 26 August 2009
Chapter 13: LPC24XX USB device controller
UM10237
© NXP B.V. 2009. All rights reserved.
387 of 792
Related parts for LPC2458FET180,551
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: