LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet
LPC2478FBD208,551
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LPC2478FBD208-S
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LPC2478FBD208,551 Summary of contents
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... USB 2.0 device/host/OTG, external memory interface Rev. 3 — 14 February 2011 1. General description NXP Semiconductors designed the LPC2470 microcontroller, powered by the ARM7TDMI-S core highly integrated microcontroller for a wide range of applications that require advanced communications and high quality graphic displays. The LPC2470 microcontroller is flashless. The LPC2470, with real-time debug interfaces that include both JTAG and embedded trace, can execute both 32-bit ARM and 16-bit Thumb instructions ...
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... NXP Semiconductors EMC provides support for asynchronous static memory devices such as RAM, ROM and flash, as well as dynamic memories such as single data rate SDRAM. Advanced Vectored Interrupt Controller (VIC), supporting vectored interrupts. General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP, ...
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... NXP Semiconductors Each peripheral has its own clock divider for further power saving. These dividers help reduce active power Brownout detect with separate thresholds for interrupt and forced reset. On-chip power-on reset. On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz. ...
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... NXP Semiconductors 5. Block diagram LPC2470 P0, P1, P2, P3, P4 HIGH-SPEED GPIO 160 PINS TOTAL AHB2 ETHERNET MII/RMII MAC WITH DMA EINT3 to EINT0 EXTERNAL INTERRUPTS P0 × CAP0/CAP1/ CAPTURE/COMPARE CAP2/CAP3 TIMER0/TIMER1/ 4 × MAT2/MAT3, TIMER2/TIMER3 2 × MAT0, 3 × MAT1 6 × PWM0/PWM1 PWM0, PWM1 1 × PCAP0, 2 × PCAP1 ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Fig 3. Table 3. Pin allocation table Pin Symbol Pin Symbol Row A 1 P3[27]/D27/ 2 CAP1[0]/PWM1[4] 5 P1[4]/ENET_TX_EN 6 9 P1[17]/ENET_MDIO 10 LPC2470 Product data sheet 1 LPC2470FBD208 52 LPC2470 pinning LQFP208 package ball A1 index area LPC2470 pinning TFBGA208 package ...
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... NXP Semiconductors Table 3. Pin allocation table Pin Symbol Pin Symbol 13 P3[20]/D20/ 14 PWM0[5]/DSR1 17 P1[5]/ENET_TX_ER/ MCIPWR/PWM0[3] Row B 1 P3[2]/ P1[1]/ENET_TXD1 6 9 P4[25]/ DD(3V3) 17 P2[0]/PWM1[1]/TXD1/ TRACECLK/LCDPWR Row C 1 P3[13]/D13 2 5 P3[9]/ DD(3V3) 13 P0[7]/I2STX_CLK/ 14 LCDVD[9]/SCK1/ MAT2[1] ...
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... NXP Semiconductors Table 3. Pin allocation table Pin Symbol Pin Symbol 14 P4[11]/A11 15 Row G 1 P3[5]/ n.c. 15 Row H 1 P0[23]/AD0[0]/ 2 I2SRX_CLK/CAP3[ SSIO Row J 1 P3[6]/ P0[16]/RXD1/ 15 SSEL0/SSEL Row K 1 VREF 2 14 P4[22]/A22/ 15 TXD2/MISO1 Row L 1 P3[7]/ n.c. 15 Row M 1 P3[15]/D15 ...
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... NXP Semiconductors Table 3. Pin allocation table Pin Symbol Pin Symbol 9 P1[23]/USB_RX_DP1/ 10 LCDVD[9]/LCDVD[13]/ PWM1[4]/MISO0 13 P2[15]/CS3/ 14 CAP2[1]/SCL1 17 V DD(3V3) Row R 1 P0[12]/USB_PPWR2/ 2 MISO1/AD0[6] 5 P3[24]/D24/ 6 CAP0[1]/PWM1[ SSIO 13 P2[17]/RAS 14 17 P4[20]/A20/SDA2/SCK1 Row T 1 P0[27]/SDA0 ...
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... NXP Semiconductors 6.2 Pin description Table 4. Pin description Symbol Pin Ball P0[0] to P0[31] [1] P0[0]/RD1/TXD3/ 94 U15 SDA1 [1] P0[1]/TD1/RXD3/ 96 T14 SCL1 [1] P0[2]/TXD0 202 C4 [1] P0[3]/RXD0 204 D6 [1] P0[4]/I2SRX_CLK/ 168 B12 LCDVD[0]/RD2/ CAP2[0] [1] P0[5]/I2SRX_WS/ 166 C12 LCDVD[1]/TD2/ ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P0[7]/I2STX_CLK/ 162 C13 LCDVD[9]/SCK1/ MAT2[1] [1] P0[8]/I2STX_WS/ 160 A15 LCDVD[16]/ MISO1/MAT2[2] [1] P0[9]/I2STX_SDA/ 158 C14 LCDVD[17]/ MOSI1/MAT2[3] [1] P0[10]/TXD2/ 98 T15 SDA2/MAT3[0] [1] P0[11]/RXD2/ 100 R14 SCL2/MAT3[1] [3] P0[12 USB_PPWR2/ MISO1/AD0[6] [3] P0[13]/ ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P0[14 USB_HSTEN2/ USB_CONNECT2/ SSEL1 [1] P0[15]/TXD1/ 128 J16 SCK0/SCK [1] P0[16]/RXD1/ 130 J14 SSEL0/SSEL [1] P0[17]/CTS1/ 126 K17 MISO0/MISO [1] P0[18]/DCD1/ 124 K15 MOSI0/MOSI [1] P0[19]/DSR1/ 122 L17 MCICLK/SDA1 [1] P0[20]/DTR1/ 120 ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [3] P0[23]/AD0[0 I2SRX_CLK/ CAP3[0] [3] P0[24]/AD0[1 I2SRX_WS/ CAP3[1] [3] P0[25]/AD0[2 I2SRX_SDA/ TXD3 [3][4] P0[26]/AD0[3 AOUT/RXD3 [5] P0[27]/SDA0 50 T1 [5] P0[28]/SCL0 48 R3 [6] P0[29]/USB_D [6] P0[30]/USB_D− [6] P0[31]/USB_D P1[0] to P1[31] [1] P1[0]/ ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P1[3]/ 177 A10 ENET_TXD3/ MCICMD/ PWM0[2] [1] P1[4]/ 192 A5 ENET_TX_EN [1] P1[5]/ 156 A17 ENET_TX_ER/ MCIPWR/ PWM0[3] [1] P1[6]/ 171 B11 ENET_TX_CLK/ MCIDAT0/ PWM0[4] [1] P1[7]/ 153 D14 ENET_COL/ MCIDAT1/ PWM0[5] [1] P1[8]/ 190 C7 ENET_CRS_DV/ ENET_CRS [1] P1[9]/ ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P1[16]/ 180 D10 ENET_MDC [1] P1[17]/ 178 A9 ENET_MDIO [1] P1[18 USB_UP_LED1/ PWM1[1]/CAP1[0] [1] P1[19 USB_TX_E1/ USB_PPWR1/ CAP1[1] [1] P1[20 USB_TX_DP1/ LCDVD[6]/ LCDVD[10]/ PWM1[2]/SCK0 [1] P1[21 USB_TX_DM1/ LCDVD[7]/ LCDVD[11]/ PWM1[3]/SSEL0 [1] P1[22]/USB_RCV1 LCDVD[8]/ LCDVD[12]/ USB_PWRD1/ ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P1[25]/USB_LS1/ 80 T10 LCDVD[11]/ LCDVD[15]/ USB_HSTEN1/ MAT1[1] [1] P1[26]/ 82 R10 USB_SSPND1/ LCDVD[12]/ LCDVD[20]/ PWM1[6]/CAP0[0] [1] P1[27]/USB_INT1/ 88 T12 LCDVD[13]/ LCDVD[21]/ USB_OVRCR1/ CAP0[1] [1] P1[28]/USB_SCL1/ 90 T13 LCDVD[14]/ LCDVD[22]/ PCAP1[0]/MAT0[0] [1] P1[29]/USB_SDA1/ 92 U14 LCDVD[15]/ ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P2[0]/PWM1[1]/ 154 B17 TXD1/TRACECLK/ LCDPWR [1] P2[1]/PWM1[2]/ 152 E14 RXD1/PIPESTAT0/ LCDLE [1] P2[2]/PWM1[3]/ 150 D15 CTS1/PIPESTAT1/ LCDDCLK [1] P2[3]/PWM1[4]/ 144 E16 DCD1/PIPESTAT2/ LCDFP [1] P2[4]/PWM1[5]/ 142 D17 DSR1/ TRACESYNC/ LCDENAB/LCDM [1] P2[5]/PWM1[6]/ ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P2[8]/TD2/TXD2/ 134 H15 TRACEPKT3/ LCDVD[2]/ LCDVD[6] [1] P2[9]/ 132 H16 USB_CONNECT1/ RXD2/EXTIN0/ LCDVD[3]/ LCDVD[7] [9] P2[10]/EINT0 110 N15 [9] P2[11]/EINT1/ 108 T17 LCDCLKIN/ MCIDAT1/ I2STX_CLK [9] P2[12]/EINT2/ 106 N14 LCDVD[4]/ LCDVD[3]/ LCDVD[8]/ ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P2[16]/CAS 87 R11 [1] P2[17]/RAS 95 R13 [1] P2[18 CLKOUT0 [1] P2[19 CLKOUT1 [1] P2[20]/DYCS0 73 T8 [1] P2[21]/DYCS1 81 U11 [1] P2[22]/DYCS2/ 85 U12 CAP3[0]/SCK0 [1] P2[23]/DYCS3 CAP3[1]/SSEL0 [1] P2[24 CKEOUT0 [1] P2[25 CKEOUT1 [1] P2[26 CKEOUT2/ MAT3[0]/MISO0 ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P2[31 DQMOUT3/ MAT3[3]/SCL2 P3[0] to P3[31] [1] P3[0]/D0 197 B4 [1] P3[1]/D1 201 B3 [1] P3[2]/D2 207 B1 [1] P3[3]/ [1] P3[4]/ [1] P3[5]/ [1] P3[6]/ [1] P3[7]/ [1] P3[8]/D8 191 D8 [1] P3[9]/D9 199 C5 [1] P3[10]/D10 205 B2 [1] P3[11]/D11 ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P3[15]/D15 28 M1 [1] P3[16]/D16/ 137 F17 PWM0[1]/TXD1 [1] P3[17]/D17/ 143 F15 PWM0[2]/RXD1 [1] P3[18]/D18/ 151 C15 PWM0[3]/CTS1 [1] P3[19]/D19/ 161 B14 PWM0[4]/DCD1 [1] P3[20]/D20/ 167 A13 PWM0[5]/DSR1 ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P3[24]/D24 CAP0[1]/ PWM1[1] [1] P3[25]/D25 MAT0[0]/ PWM1[2] [1] P3[26]/D26 MAT0[1]/ PWM1[3] [1] P3[27]/D27/ 203 A1 CAP1[0]/ PWM1[4] [1] P3[28]/D28 CAP1[1]/ PWM1[5] [1] P3[29]/D29 MAT1[0]/ PWM1[6] [1] P3[30]/D30 MAT1[1]/ RTS1 [1] P3[31]/D31 MAT1[2] ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P4[3]/A3 97 U16 [1] P4[4]/A4 103 R15 [1] P4[5]/A5 107 R16 [1] P4[6]/A6 113 M14 [1] P4[7]/A7 121 L16 [1] P4[8]/A8 127 J17 [1] P4[9]/A9 131 H17 [1] P4[10]/A10 135 G17 [1] P4[11]/A11 145 F14 [1] P4[12]/A12 149 ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P4[21]/A21/ 115 M15 SCL2/SSEL1 [1] P4[22]/A22/ 123 K14 TXD2/MISO1 [1] P4[23]/A23/ 129 J15 RXD2/MOSI1 [1] P4[24]/OE 183 B8 [1] P4[25]/WE 179 B9 [1] P4[26]/BLS0 119 L15 [1] P4[27]/BLS1 139 G15 [1] P4[28]/BLS2/ 170 ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1][16] TMS 6 E3 [1][16] TRST 8 D1 [1][17] TCK 10 E2 [1][16] RTCK 206 C3 RSTOUT 29 K3 [12] RESET 35 M2 [13][14] XTAL1 44 M4 [13][14] XTAL2 46 N4 [13][15] RTCX1 34 K2 [13][15] RTCX2 33, 63, L3, T5, SSIO 77, 93, R9, P12, ...
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... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [13] VREF 24 K1 [13] VBAT tolerant pad providing digital I/O functions with TTL levels and hysteresis. 2 [2] Either the I S function or the LCD function is selectable, see [ tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input, digital section of the pad is disabled ...
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... NXP Semiconductors 7. Functional description 7.1 Architectural overview The LPC2470 microcontroller consists of an ARM7TDMI-S CPU with emulation support, the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external memory, and the AMBA APB for connection to other on-chip peripheral functions. The microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte order ...
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... NXP Semiconductors The Thumb set’s 16-bit instruction length allows it to approach higher density compared to standard ARM code while retaining most of the ARM’s performance. 7.2 On-chip SRAM The LPC2470 includes a SRAM memory reserved for the ARM processor exclusive use. This RAM may be used for code and/or data storage and may be accessed as 8 bits, 16 bits, and 32 bits ...
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... NXP Semiconductors 3.75 GB Fig 4. 7.4 Interrupt controller The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast Interrupt Request (FIQ). The VIC takes 32 interrupt request inputs which can be programmed as FIQ or vectored IRQ types. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted ...
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... NXP Semiconductors service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a programmable interrupt priority ...
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... NXP Semiconductors – Asynchronous page mode read – Programmable Wait States – Bus turnaround delay – Output enable and write enable delays – Extended wait • Four chip selects for synchronous memory and four chip selects for static memory devices. • ...
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... NXP Semiconductors • One AHB master for transferring data. This interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data ...
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... NXP Semiconductors 7.9 LCD controller The LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can 1024 × 768 pixels ...
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... NXP Semiconductors The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic in the LPC2470 takes place on a different AHB subsystem, effectively separating Ethernet activity from the rest of the system. The Ethernet DMA can also access off-chip memory via the EMC, as well as the SRAM located on another AHB ...
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... NXP Semiconductors 7.11 USB interface The Universal Serial Bus (USB 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller ...
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... NXP Semiconductors 7.11.3 USB OTG controller USB OTG is a supplement to the USB 2.0 specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals. The OTG controller integrates the host controller, device controller, and a master-only I interface to implement OTG dual-role device functionality ...
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... NXP Semiconductors 7.13 10-bit ADC The LPC2470 contains one ADC single 10-bit successive approximation ADC with eight channels. 7.13.1 Features • 10-bit successive approximation ADC • Input multiplexing among 8 pins • Power-down mode • Measurement range 10-bit conversion time ≥ 2.44 μs • ...
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... NXP Semiconductors • UART3 includes an IrDA mode to support infrared communication. 7.16 SPI serial I/O controller The LPC2470 contains one SPI controller. SPI is a full duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer ...
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... NXP Semiconductors • Conforms to Multimedia Card Specification v2.11. • Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. • Can be used as a multimedia card bus or a secure digital memory card bus host. The SD/MMC can be connected to several multimedia cards or a single secure digital memory card. • ...
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... NXP Semiconductors 7.20.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1, 48) kHz. • ...
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... NXP Semiconductors 7.22 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2470. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers ...
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... NXP Semiconductors • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • ...
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... NXP Semiconductors The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. When the CPU and the rest of chip functions are stopped and power removed, the RTC can supply an alarm output that can be used by external hardware to restore chip power and resume operation ...
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... NXP Semiconductors PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to 7.25.1.3 RTC oscillator The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the RTC oscillator can be used to drive the PLL and the CPU ...
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... NXP Semiconductors 7.25.4 Power control The LPC2470 supports a variety of power control features. There are four special modes of processor power reduction: Idle mode, Sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements ...
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... NXP Semiconductors 7.25.4.4 Deep power-down mode Deep power-down mode is similar to the Power-down mode, but now the on-chip regulator that supplies power to the internal logic is also shut off. This produces the lowest possible power consumption without removing power from the entire chip. Since the Deep ...
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... NXP Semiconductors level, starts the wake-up timer (see description in causing reset to remain asserted until the external Reset is de-asserted, the oscillator is running, and a fixed number of clocks have passed. Once the internal reset is removed, all of the processor and peripheral registers have been initialized to predetermined values and the LPC2470 continues with booting from an external static memory ...
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... NXP Semiconductors In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block. 7.26.5 External interrupt inputs The LPC2470 includes edge sensitive interrupt inputs combined with up to four level sensitive external interrupt inputs as selectable pin functions ...
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... NXP Semiconductors information about processor execution to a trace port. A software debugger allows configuration of the ETM using a JTAG interface and displays the trace information that has been captured. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port ...
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... NXP Semiconductors 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage (3.3 V) DD(3V3) V DC-to-DC converter supply voltage DD(DCDC)(3V3) (3 analog 3.3 V pad supply voltage DDA V input voltage on pin VBAT i(VBAT) V input voltage on pin VREF ...
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... NXP Semiconductors 9. Thermal characteristics The average chip junction temperature, T equation amb • T amb • R th(j-a) • The internal power dissipation is the product of I the I/O pins is often small and many times can be negligible. However it can be significant in some applications. Table 7. Thermal characteristics = − ...
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... NXP Semiconductors 10. Static characteristics Table 8. Static characteristics = −40 °C to +85 °C for commercial applications, unless otherwise specified. T amb Symbol Parameter V supply voltage (3.3 V) DD(3V3) V DC-to-DC converter DD(DCDC)(3V3) supply voltage (3 analog 3.3 V pad DDA supply voltage V input voltage on pin i(VBAT) VBAT ...
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... NXP Semiconductors Table 8. Static characteristics = −40 °C to +85 °C for commercial applications, unless otherwise specified. T amb Symbol Parameter V LOW-level input IL voltage V hysteresis voltage hys V HIGH-level output OH voltage V LOW-level output OL voltage I HIGH-level output OH current I LOW-level output OL current I HIGH-level OHS short-circuit output current ...
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... NXP Semiconductors Table 8. Static characteristics = −40 °C to +85 °C for commercial applications, unless otherwise specified. T amb Symbol Parameter Oscillator pins V input voltage on pin i(XTAL1) XTAL1 V output voltage on pin o(XTAL2) XTAL2 V input voltage on pin i(RTCX1) RTCX1 V output voltage on pin o(RTCX2) RTCX2 USB pins ...
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... NXP Semiconductors 10.1 Power-down mode I DD(IO) (μA) Fig 5. I (μA) Fig 6. LPC2470 Product data sheet −2 −4 −40 − 3 i(VBAT) DD(DCDC)(3V3) amb I/O maximum supply current I 40 BAT 3.3 V i(VBAT 3.0 V i(VBAT −40 − 3 DD(3V3) DD(DCDC)(3V3) RTC battery maximum supply current I mode All information provided in this document is subject to legal disclaimers ...
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... NXP Semiconductors I DD(DCDC)pd(3v3) Fig 7. 10.2 Deep power-down mode I DD(IO) (μA) Fig 8. LPC2470 Product data sheet 800 (μA) 600 400 V = 3.3 V DD(DCDC)(3V3) 200 V = 3.0 V DD(DCDC)(3V3) 0 −40 − ° 3 DD(3V3) i(VBAT) amb Total DC-to-DC converter supply current I in Power-down mode 300 ...
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... NXP Semiconductors I (μA) Fig 9. I DD(DCDC)dpd(3v3) Fig 10. Total DC-to-DC converter maximum supply current I LPC2470 Product data sheet 40 BAT 3.3 V i(VBAT 3.0 V i(VBAT −40 − 3 DD(3V3) DD(DCDC)(3V3) RTC battery maximum supply current I power-down mode 100 (μ 3.3 V DD(DCDC)(3V3 3.0 V DD(DCDC)(3V3) ...
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... NXP Semiconductors 10.3 Electrical pin characteristics V Fig 11. Typical HIGH-level output voltage V (mA) Fig 12. Typical LOW-level output current I LPC2470 Product data sheet 3 °C 25 °C 3.2 −40 °C 2.8 2.4 2 Conditions 3.3 V; standard port pins. DD(3V3 0.2 Conditions 3.3 V; standard port pins. ...
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... NXP Semiconductors 11. Dynamic characteristics Table 9. Dynamic characteristics = −40 °C to +85 °C for commercial applications amb Symbol Parameter External clock f oscillator frequency osc T clock cycle time cy(clk) t clock HIGH time CHCX t clock LOW time CLCX t clock rise time CLCH t clock fall time ...
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... NXP Semiconductors 11.1 Internal oscillators Table 10. Dynamic characteristic: internal oscillators = −40 °C to +85 °C; 3.0 V ≤ amb Symbol Parameter f internal RC oscillator frequency osc(RC) f RTC input frequency i(RTC) [1] Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. ...
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Static external memory interface Table 13. Dynamic characteristics: Static external memory interface = −40 ° ° pF amb DD(DCDC)(3V3) Symbol Parameter Conditions [1] Common to read and write cycles t CS ...
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Table 13. Dynamic characteristics: Static external memory interface = −40 ° ° pF amb DD(DCDC)(3V3) Symbol Parameter Conditions t WE HIGH to data invalid WEHDNV time t BLS HIGH to address BLSHANV ...
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... NXP Semiconductors 11.5 Dynamic external memory interface Table 14. Dynamic characteristics: Dynamic external memory interface = −40 ° ° pF amb Config Register = 0x0 (RD = 00) Symbol Parameter Common t chip select valid delay time d(SV) t chip select hold time h(S) t row address strobe valid delay time ...
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... NXP Semiconductors 11.6 Timing CS addr data t CSLOEL OE BLS Fig 14. External memory read access CS BLS/WE addr data OE Fig 15. External memory write access LPC2470 Product data sheet t CSLAV OELAV t OELOEH t BLSLAV t CSLAV t WELWEH t CSLWEL t BLSLBLSH t t CSLBLSL WELDV t CSLDV All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors T PERIOD differential data lines Fig 16. Differential data-to-EOP transition skew and EOP width shifting edges SCK MOSI MISO Fig 17. MISO line set-up time in SSP Master mode Fig 18. Signal timing LPC2470 Product data sheet crossover point crossover point differential data to SE0/EOP skew n × ...
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... NXP Semiconductors 12. ADC electrical characteristics Table 15. ADC static characteristics = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz 2 3 DDA amb Symbol Parameter V analog input voltage IA C analog input capacitance ia E differential linearity error D E integral non-linearity L(adj) E offset error ...
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... NXP Semiconductors 1023 1022 1021 1020 1019 1018 7 code out offset error E O (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (E (4) Integral non-linearity (E L(adj) (5) Center of a step of the actual transfer curve. Fig 19. ADC characteristics LPC2470 Product data sheet ...
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... NXP Semiconductors AD0[y] Fig 20. Suggested ADC interface - LPC2470 AD0[y] pin LPC2470 Product data sheet LPC2XXX 20 kΩ SAMPLE SSIO, SSCORE All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 February 2011 LPC2470 Flashless 16-bit/32-bit microcontroller R vsi AD0[y] V EXT 002aad586 © NXP B.V. 2011. All rights reserved. ...
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... NXP Semiconductors 13. DAC electrical characteristics Table 16. DAC electrical characteristics = −40 °C to +85 °C unless otherwise specified DDA amb Symbol Parameter E differential linearity error D E integral non-linearity L(adj) E offset error O E gain error G C load capacitance L R load resistance L 14. Application information 14 ...
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... NXP Semiconductors Table 17. LCD panel connections for STN single panel mode External pin 4-bit mono STN single panel LPC2470 pin used [1] LCDLP P2[5] [1] LCDENAB/ P2[4] LCDM [1] LCDFP P2[3] [1] LCDDCLK P2[2] [1] LCDLE P2[1] [1] LCDPWR P2[0] [2] LCDCLKIN P2[11] [1] ETM replaced with LCD pins. ...
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... NXP Semiconductors Table 18. LCD panel connections for STN dual panel mode External pin 4-bit mono STN dual panel LPC2470 pin used [1] LCDVD[0] P2[6] [1] LCDLP P2[5] [1] LCDENAB/ P2[4] LCDM [1] LCDFP P2[3] [1] LCDDCLK P2[2] [1] LCDLE P2[1] [1] LCDPWR P2[0] [2] LCDCLKIN P2[11] [1] ETM replaced with LCD pins. ...
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... NXP Semiconductors Table 19. LCD panel connections for TFT panels External TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) pin LPC2470 LCD pin used function LCDVD[ LCDVD[ LCDVD[ [1] LCDLP P2[5] LCDLP [1] LCDENAB/ P2[4] LCDENAB/ LCDM LCDM [1] LCDFP P2[3] LCDFP [1] LCDDCLK P2[2] LCDDCLK ...
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... NXP Semiconductors Fig 22. Booting from a single 16-bit memory chip 14.3 Suggested USB interface solutions LPC24XX Fig 23. LPC2470 USB interface on a self-powered device LPC2470 Product data sheet CS1 16-bit BLS1 MEMORY LB BLS0 IO[15:0] D[15:0] A[a_m:0] A[a_b:1] 002aad323 V DD(3V3) USB_UP_LED USB_CONNECT soft-connect switch R1 1.5 kΩ ...
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... NXP Semiconductors LPC24XX Fig 24. LPC2470 USB interface on a bus-powered device LPC2470 Product data sheet V DD(3V3 USB_UP_LED 1.5 kΩ V BUS Ω USB_D Ω USB_D− SSIO, SSCORE All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 February 2011 LPC2470 Flashless 16-bit/32-bit microcontroller ...
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... NXP Semiconductors RSTOUT USB_SCL1 USB_SDA1 USB_INT1 USB_D+1 USB_D−1 USB_UP_LED1 LPC24XX USB_PPWR2 USB_OVRCR2 USB_PWRD2 USB_D+2 USB_D−2 USB_UP_LED2 Fig 25. LPC2470 USB OTG port configuration: USB port 1 OTG dual-role device, USB port 2 host LPC2470 Product data sheet RESET_N ADR/PSW OE_N/INT_N V DD SPEED ...
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... NXP Semiconductors RSTOUT USB_TX_E1 USB_TX_DP1 USB_TX_DM1 USB_RCV1 USB_RX_DP1 USB_RX_DM1 LPC24XX USB_SCL1 USB_SDA1 USB_INT1 USB_UP_LED1 Fig 26. LPC2470 USB OTG port configuration: VP_VM mode LPC2470 Product data sheet V DD RESET_N OE_N/INT_N DAT_VP SE0_VM RCV ISP1302 ADR/PSW SPEED SUSPEND SCL SDA INT_N V DD All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors USB_UP_LED1 USB_D+1 USB_D−1 USB_PWRD1 USB_OVRCR1 USB_PPWR1 LPC24XX USB_UP_LED2 USB_CONNECT2 USB_D+2 USB_D−2 V BUS Fig 27. LPC2470 USB OTG port configuration: USB port 2 device, USB port 1 host LPC2470 Product data sheet Ω 33 Ω 15 kΩ 15 kΩ ENA 5 V LM3526-L ...
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... NXP Semiconductors USB_UP_LED1 USB_D+1 USB_D−1 USB_PWRD1 USB_OVRCR1 USB_PPWR1 LPC24XX USB_PPWR2 USB_OVRCR2 USB_PWRD2 USB_D+2 USB_D−2 USB_UP_LED2 Fig 28. LPC2470 USB OTG port configuration: USB port 1 host, USB port 2 host 14.4 Crystal oscillator XTAL input and component selection The input voltage to the on-chip oscillators is limited to 1 the oscillator is driven by a ...
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... NXP Semiconductors In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in ...
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... NXP Semiconductors Table 21. Fundamental oscillation frequency F 15 MHz to 20 MHz 20 MHz to 25 MHz 14.5 RTC 32 kHz oscillator component selection Fig 31. RTC oscillator modes and models: oscillation mode of operation and external The RTC external oscillator circuit is shown in integrated on chip, only a crystal, the capacitances C externally to the microcontroller ...
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... NXP Semiconductors 14.6 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors C third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain ...
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... NXP Semiconductors 14.8 Reset pin configuration Fig 33. Reset pin configuration LPC2470 Product data sheet reset GLITCH FILTER All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 February 2011 LPC2470 Flashless 16-bit/32-bit microcontroller ESD ESD V SS 002aaf274 © NXP B.V. 2011. All rights reserved. ...
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... NXP Semiconductors 15. Package outline LQFP208; plastic low profile quad flat package; 208 leads; body 1 156 157 pin 1 index 208 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 1.45 mm 1.6 0.25 0.05 1.35 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 0.7 mm ball A1 index area ball index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.4 0.8 0.5 mm 1.2 0.3 0.6 0.4 OUTLINE VERSION IEC SOT950-1 Fig 35. Package outline SOT950-1 (TFBGA208) ...
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... NXP Semiconductors 16. Abbreviations Table 23. Acronym ADC AHB AMBA APB BLS BOD CAN DAC DCC DMA EOP ETM GPIO IrDA JTAG LCD MII MIIM OHCI OTG PHY PLL POR PWM RMII SD/MMC SE0 SPI SSI SSP TTL UART USB LPC2470 Product data sheet ...
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... NXP Semiconductors 17. Revision history Table 24. Revision history Document ID Release date LPC2470 v.3 20110214 • Changed data sheet status to Product data sheet. • Table 4 “Pin • Table 4 “Pin • Table 4 “Pin pins. • Table 4 “Pin • Table 8 “Static • Table 8 “Static I • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... For sales office addresses, please send an email to: LPC2470 Product data sheet own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Functional description . . . . . . . . . . . . . . . . . . 26 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 26 7.2 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 27 7.3 Memory map 7.4 Interrupt controller ...
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... NXP Semiconductors 11.4 Static external memory interface . . . . . . . . . . 60 11.5 Dynamic external memory interface . . . . . . . . 62 11.6 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 12 ADC electrical characteristics . . . . . . . . . . . . 65 13 DAC electrical characteristics . . . . . . . . . . . . 68 14 Application information 14.1 LCD panel signal usage . . . . . . . . . . . . . . . . . 68 14.2 Suggested boot memory interface solutions 14.3 Suggested USB interface solutions . . . . . . . . 72 14 ...