LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 84

• Manufacturer Part Number: LPC2478FBD208,551
• Description: IC ARM7 MCU 512K LCD 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2478FBD208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
• Development Tools By Supplier: OM11015, OM11019, OM11022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4363; 935284069551; LPC2478FBD208-S

NXP Semiconductors
15. Package outline
Fig 32. Package outline SOT459-1 (LQFP208)
LPC2478
Product data sheet
LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
208
157
VERSION
OUTLINE
SOT459-1
156
y
1
max.
1.6
A
pin 1 index
e
0.15
0.05
A
1
1.45
1.35
A
2
136E30
IEC
0.25
A
b
3
p
H
D
D
0.27
0.17
b
p
w
M
0.20
0.09
c
All information provided in this document is subject to legal disclaimers.
MS-026
JEDEC
28.1
27.9
D
(1)
Z D
REFERENCES
Rev. 2 — 29 September 2010
X
28.1
27.9
E
(1)
105
52
0
104
53
0.5
e
Z E
B
b
JEITA
scale
30.15
29.85
e
w
p
H
5
v
D
M
M
v
30.15
29.85
M
B
H
E
10 mm
A
E
A
H
E
L
1
Single-chip 16-bit/32-bit microcontroller
0.75
0.45
L
p
A
0.12
A
v
2
A
1
0.08
w
PROJECTION
EUROPEAN
0.08
detail X
y
1.43
1.08
Z
D
LPC2478
© NXP B.V. 2010. All rights reserved.
1.43
1.08
Z
E
ISSUE DATE
L
L
p
00-02-06
03-02-20
7
0
(A )
θ
o
o
SOT459-1
3
θ
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