LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 85

• Manufacturer Part Number: LPC2478FBD208,551
• Description: IC ARM7 MCU 512K LCD 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2478FBD208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
• Development Tools By Supplier: OM11015, OM11019, OM11022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4363; 935284069551; LPC2478FBD208-S

NXP Semiconductors
Fig 33. Package outline SOT950-1 (TFBGA208)
LPC2478
Product data sheet
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT950-1
VERSION
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
T
P
K
H
F
D
B
G
U
R
N
L
J
E
C
A
0.8
0.6
A
2
1
IEC
2
0.5
0.4
3
b
4
5
15.1
14.9
6
D
e
7
8
15.1
14.9
e
D
9
JEDEC
E
1
All information provided in this document is subject to legal disclaimers.
10
- - -
11
REFERENCES
12
0.8
e
13
Rev. 2 — 29 September 2010
0
14
12.8
15
e
b
1
16
17
12.8
JEITA
e
2
scale
5
B
e
0.15
∅ v
∅ w
v
e
A
E
M
M
2
0.08
C
C
w
A
10 mm
B
0.12
y
Single-chip 16-bit/32-bit microcontroller
A
0.1
y
A
1
2
A
1
y
1
PROJECTION
EUROPEAN
C
detail X
C
X
y
LPC2478
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
06-06-01
06-06-14
SOT950-1
85 of 91