STM8S207R6T6 STMicroelectronics, STM8S207R6T6 Datasheet - Page 87

MCU 8BIT 32K MEMORY 64-LQFP

STM8S207R6T6

Manufacturer Part Number
STM8S207R6T6
Description
MCU 8BIT 32K MEMORY 64-LQFP
Manufacturer
STMicroelectronics
Series
STM8Sr
Datasheet

Specifications of STM8S207R6T6

Mfg Application Notes
STM8S Getting Started
Core Processor
STM8
Core Size
8-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.95 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM8S20x
Core
STM8
Data Bus Width
8 bit
Data Ram Size
6 KB
Interface Type
CAN, 12C, SPI, UART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
52
Number Of Timers
2
Operating Supply Voltage
2.95 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWSTM8
Development Tools By Supplier
STICE-SYS001
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
For Use With
497-10032 - EVAL KIT MOTOR CONTROL STM8S497-10031 - EVAL KIT TOUCH SENSING STM8S497-8852 - BOARD DEMO STM8S207R6/LIS331DLH497-8851 - BOARD DEMO STM8S207R6/LIS331DLH497-10592 - BOARD DAUGHTER FOR STM8S207/8497-10593 - KIT STARTER FOR STM8S207/8 SER497-8506 - BOARD EVAL FOR STM8S
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8953
STM8S207R6T6

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STM8S207xx, STM8S208xx
10.3.11
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
While executing a simple application (toggling 2 LEDs through I/O ports), the product is
stressed by two electromagnetic events until a failure occurs (indicated by the LEDs).
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
recovered by applying a low state on the NRST pin or the oscillator pins for 1 second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Table 47.
Symbol
V
V
FESD
EFTB
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 61000-4-2
standard.
FTB: A burst of fast transient voltage (positive and negative) is applied to V
through a 100 pF capacitor, until a functional disturbance occurs. This test conforms
with the IEC 61000-4-4 standard.
Corrupted program counter
Unexpected reset
Critical data corruption (control registers...)
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100pF on V
to induce a functional disturbance
EMS data
Parameter
Doc ID 14733 Rev 11
DD
and V
SS
pins
V
f
conforming to IEC 61000-4-2
V
f
conforming to IEC 61000-4-4
MASTER
MASTER
DD
DD
5 V, T
5 V, T
16 MHz,
16 MHz,
Conditions
A
A
25 °C,
25 °C,
Electrical characteristics
DD
Level/class
and V
2B
4A
87/105
SS

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