STM32F100VBT6B STMicroelectronics, STM32F100VBT6B Datasheet - Page 80
STM32F100VBT6B
Manufacturer Part Number
STM32F100VBT6B
Description
MCU 32BIT 128K FLASH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F100VBT6B
Featured Product
STM32 Value Line
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM32100B-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10659
STM32F100VBT6B
STM32F100VBT6B
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Package characteristics
6.2
6.2.1
80/86
Thermal characteristics
The maximum chip junction temperature (T
Table 8: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 51.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
I/O
Symbol
max represents the maximum power dissipation on output pins where:
T
P
P
internal power.
P
JA
A
D
INT
I/O
JA
max is the maximum ambient temperature in C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
max is the product of I
Thermal resistance junction-ambient
LQFP 100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 48 - 7 × 7 mm / 0.5 mm pitch
Package thermal characteristics
OL
× I
OL
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
INT
T
) + ((V
Parameter
J
Doc ID 16455 Rev 5
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
34.
/ I
OH
D
OH
),
max x
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Value
46
45
65
55
max + P
I/O
max),
°C/W
Unit