ST62T25CB6 STMicroelectronics, ST62T25CB6 Datasheet - Page 92

• Manufacturer Part Number: ST62T25CB6
• Description: IC MCU 8BIT OTP 4K 28 PDIP
• Manufacturer: STMicroelectronics
• Series: ST6r

Specifications of ST62T25CB6

• Core Processor: ST6
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: LVD, POR, WDT
• Number Of I /o: 20
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: OTP
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6 V
• Data Converters: A/D 16x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.600", 15.24mm)
• Processor Series: ST62T2x
• Core: ST6
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 20
• Number Of Timers: 1
• Operating Supply Voltage: 3 V to 6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST62GP-EMU2, ST62E2XC-EPB/110, ST62E6XC-EPB/US, ST622XC-KIT/110, STREALIZER-II
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 8-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2100-5

ST6215CM-Auto ST6225CM-Auto
12.2 THERMAL CHARACTERISTICS
Notes:
1. The power dissipation is obtained from the formula P
2. The average chip-junction temperature can be obtained from the formula T
12.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
■
■
Table 22. Soldering Compatibility (Wave and Reflow Soldering Process)
12.4 PACKAGE/SOCKET FOOTPRINT PROPOSAL
Table 23. Suggested List of SO28 Socket Types
92/100
1
SO28
EMU PROBE
Programming
Adapter
Package / Probe
and P
ECOPACK
to the JEDEC STD-020B compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
www.st.com/stonline/leadfree/,
technical application notes covering the main
technical
conversion
AN2036).
Package
®
PORT
Symbol
.
SO28
T
R
Jmax
P
thJA
D
is the port power dissipation determined by the user.
®
®
aspects
transition program is available on
packages are qualified according
(AN2033,
ENPLAS
YAMAICHI
Adapter from SO28 to DIP28 footprint
(delivered with emulator)
Logical Systems
Package thermal resistance (junction to ambient)
SO28
Power dissipation
Maximum junction temperature
NiPdAu (Nickel-Palladium-Gold)
related
Plating Material Devices
AN2034,
Adaptor / Socket Reference
with
to
OTS-28-1.27-04
IC51-0282-334-1
PA28SO1-08-6
1)
lead-free
AN2035,
specific
Ratings
D
= P
2)
INT
Forward compatibility
ECOPACK
with lead (Pb) containing soldering process (see
application note AN2034).
+ P
PORT
Pb Solder Paste
where P
®
Yes
J
LQFP packages are fully compatible
= T
INT
A
+ P
is the chip internal power (I
D
Footprint
x RthJA.
Same
Value
150
500
X
X
75
Pb-free Solder Paste
Open Top
Clamshell
SMD to DIP
Open Top
Socket Type
Yes
°C/W
DD
Unit
mW
°C
xV
DD
)